Electronics Forum: microbga rework (Page 1 of 3)

BGA rework profile help

Electronics Forum | Wed Jun 06 09:09:28 EDT 2001 | nwyatt

Help! I have been assigned to take over our current rework machine because the profiles have been changed so often and by so many people that they are now not working consistantly. Nobody has been supporting it for the past 2 years and now I have b

Micro BGA Rework

Electronics Forum | Tue Jun 11 14:16:03 EDT 2013 | bandjwet

We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi

Micro BGA Rework

Electronics Forum | Tue Jun 11 14:21:35 EDT 2013 | bandjwet

We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi

IR Rework Machine

Electronics Forum | Thu Jun 28 15:22:59 EDT 2012 | spitkis2

Would like to ask end users or those with experience using infra red rework equipment (specifically when the top heater is IR) the following: 1. Can you successfully rework Package On Package (PoP) type devices? With heat directed through the packa

BGA adapter boad?

Electronics Forum | Fri Jan 05 10:15:55 EST 2007 | Cmiller

I have a customer working on a new design of a rather large board that needs to use a micro BGA that will require 8 layers. He needs to use that BGA and it does not come in any other package. He asked me about making the BGA an adapter or daughter bo

Re: I've Gotta Vision

Electronics Forum | Fri Sep 22 08:37:07 EDT 2000 | Erick Russell

For any rework machine a good optics system is important. A look-up look down is used for BGA components. 30X magnification is required for flip chip, MicroBGA and fine pitch QFP placement. Digital cameras are not required, CCD have a good enoug

SRT Rework Station, Model FPD-W

Electronics Forum | Thu Feb 17 16:55:50 EST 2000 | Brian Husnik

I am evaluating the purchase of a used SRT Rework Station, Model # 'FPD-W', and would like to hear from anyone who has any experience, thoughts, comments or suggestions regarding this station. We will be using the station for removal and placement o

SRT Rework Station, Model FPD-W

Electronics Forum | Thu Feb 17 16:55:50 EST 2000 | Brian Husnik

I am evaluating the purchase of a used SRT Rework Station, Model # 'FPD-W', and would like to hear from anyone who has any experience, thoughts, comments or suggestions regarding this station. We will be using the station for removal and placement o

Re: Voids in micro-BGA solder joint

Electronics Forum | Wed Jan 14 23:08:19 EST 1998 | Ron Costa

Place your components directly on the PCB without using solder paste,unless your using high temp. solder spheres then you should use paste. If eutectic solder spheres are used try fluxing the BGA area and attach it directly to the board. This will re

Re: Reliability of Reworked BGAs/CSPs

Electronics Forum | Thu Feb 04 15:44:04 EST 1999 | Michael Allen

Actually, solder paste adds about 12% to the joint volume for PBGAs, or about 31% for MicroBGAs -- assuming standard (recommended) pad sizes and stencil thicknesses, and paste with 90% metal content (50% metal by volume). I'd like to find some t

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