Electronics Forum: microelectronics and lab (Page 1 of 4)

COB and wire bond

Electronics Forum | Mon May 07 22:29:52 EDT 2001 | davef

4 wire per sec ... you figure how many you need] Encapsulation ~$120K for a dispenser [10 sec per die ... you figure how many you need] plus a cure oven ~$100k Throw in a another ~$100k for marking and cleaning Check the September 2000 SMTnet New

Re: SO-8 and SO-14

Electronics Forum | Tue Nov 09 13:20:21 EST 1999 | Dave F

Chuck: Try: 1 WWW.JEDEC.ORG 2 Search "surface mount package" which gives you ... MO-Index INDEX OF MO OUTLINES IN PUBLICATION NO. 95 BY-FAMILY INDEX OF REGISTERED MICROELECTRONIC (MO) OUTLINES (contains description of the content of each file) Goo

Re: HAST and HALT

Electronics Forum | Sat Oct 24 06:07:09 EDT 1998 | Earl Moon

| Hi, | Am looking out for companies which would perform the "highly accelerated stress testing" for my PCB test assembly samples. does anybody have any info regarding this. | thanks, | subhash | Most independent PCB test labs, often doing military

Re: HAST and HALT

Electronics Forum | Mon Oct 26 14:56:07 EST 1998 | carl m

| | Hi, | | Am looking out for companies which would perform the "highly accelerated stress testing" for my PCB test assembly samples. does anybody have any info regarding this. | | thanks, | | subhash | | | Most independent PCB test labs, often do

Inspection and Sorting House

Electronics Forum | Tue Oct 25 14:33:13 EDT 2005 | travelinman

I dont know if you found anyone to do your inspection and sorting in China but I am the owner of Strategic Manufacturing Solutions LLC and we do contract manufacturing and have an indepentant inspection lab in Shanghai. We could be reach at 847.359.

OSP and SIR

Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef

Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem

Imm Silver and Voiding

Electronics Forum | Wed Jun 28 22:34:31 EDT 2006 | davef

Yes, it would. That you are asking this question makes us wonder if you would be better advised to contract with a independent FA laboratory to help you baseline your analysis. Among the fine labs to consider are: * Robisan Laboratory 6502 East 21

Mydata Pick and place

Electronics Forum | Wed May 09 12:07:52 EDT 2001 | caldon

My personal favorite is the Siemens F series and the UIC GSM platform. Both Siemens and UIC have awesome resources for csp, flipchip and baredie processing - Siemens= Dan Baldwin from GaTech; UIC = George Westby from UIC labs. My second choice would

Pick and Place Machine Validation

Electronics Forum | Mon Mar 14 11:41:39 EST 2005 | pjc

This company can come in to your facility with equipment to measure the pick-&-place machine's accuracy and repeatability of placements in X-Y-Theta: in North America, http://americas.cetaq.com/index.php?lang=en in Europe, http://www.cetaq.com/

Decoupling caps and PCB layout

Electronics Forum | Wed Aug 10 02:38:36 EDT 2016 | zxcvb

I guess I've been somewhat ignorant when it comes to the finer details of pcb layout. Lately I've read a couple of books that try their best to lead me on the straight and narrow. Here is a couple of examples of a recent board of mine, and I have hig

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