Electronics Forum: micronic (Page 1 of 30)

Copper Foil Thickness

Electronics Forum | Sat Jan 08 06:46:33 EST 2022 | jineshjpr

Hi anyone knows what is the minimum copper foil thickness available across the industries to make PCB surface. Intention is to achieve 23 microns of finished copper thickness in a 0.3mm thickness PCB. Ideally if 3 microns plates are available, additi

15.7 mil QFP

Electronics Forum | Fri May 30 20:54:53 EDT 2003 | jonfox

Conversion refresher: 1 inch = 25.4 mm 1 inch = 25,400 microns 10 microns = 0.3937 mils 10 microns = 0.010 mm so 0.4mm = 400 microns and for s/n/g: 1mm = 3.240783e-20 parsecs (pc) Have some fun with that one!

Land size

Electronics Forum | Wed Jul 09 10:15:57 EDT 2008 | aj

I have carried out some further measurements on the device and the results are as follow: Component Lead width measures 183 microns. Actuals PAD width measures 158 microns. What I am thinking is that the lead is attracting the solder hence prevent

2 oz Copper thickness??

Electronics Forum | Mon Apr 22 16:31:53 EDT 2013 | anvil1021

So, I was wondering how thick 2 oz. Copper is supposed to be? I have heard 60 microns and 70 microns, but the PCBs that we have that are supposed to be 2oz Copper are 68.5 microns, the Customer would like at least 60 microns, but what is the reality

Imm Silver tarnish?

Electronics Forum | Wed Sep 03 16:15:30 EDT 2008 | blnorman

Elemental is by SEM/EDX. The brown coloration does resemble the 3 micron photo. Again, if I'm picking up copper (our Ag plating thickness requirements are 0.05 micron to 0.12 micron following IPC 4553), maybe we do have a porous silver plating.


Electronics Forum | Wed Mar 06 10:29:40 EST 2013 | sara_pcb

What is the minimum solder mask thickness required for Class 3 products. We are insisting fabricator of the pcb shop to use only spray coated solder mask. The SM thickness on the epoxy is about 17 microns, In the center of the tracks are 8 microns an

Esec Micron2 vs. RD Automation CDB-50

Electronics Forum | Fri Dec 10 18:02:45 EST 2004 | Sam El.

I was wondering if anyone has had any experience with either the Esec Micron 2 or the RD Automation CDB-50? We currently have a Micron 2 (1997 build). We are using it for small batches of flip chip. We use the waffle pack feeder not the wafer loader.

Re: BGA problem: open after reflow

Electronics Forum | Thu Nov 02 22:11:46 EST 2000 | Dason C

Please check with Fab house, what is the thickness of the immersion gold if the gold thicknesss is less than say 2.5 micron, you will found dewetting or open. It is recommend the gold thickness is around 5 micron. Good Luck Dason

What's The Resolution?

Electronics Forum | Mon Jun 18 18:17:10 EDT 2001 | davef

What to you consider to be the minimum resolution [micron] for: General, BGA, die attach uBGA, flipchip, wire bonds Wire cracks, delamination Microcircuit failure What is the relationship between resolution [micron] and the kV of the tube?

Re: Solder paste print with two thicknesses

Electronics Forum | Thu Oct 08 03:27:00 EDT 1998 | Thomas Blesinger

| | | I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the rema

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