Electronics Forum: micronic (Page 26 of 30)

AOI

Electronics Forum | Wed Jan 26 07:18:13 EST 2005 | clampron

Good Morning TM, We have a table top AOI (actually several of them) We did a side by side evaluation when we first looked at it. We looked at Qualectron, NSpec and Mirtec (Samsung at the time). Some of the criteria that was important to us: *Librar

Nozzle life?

Electronics Forum | Thu Feb 24 06:11:18 EST 2005 | siverts

Nozzle used? Nozzle tip damaged/worn-out (that's where the nozzle life comes in)? Component package? Heavy component? Feeder? Do You see that component type, used by that nozzle inside the machine, or components at the wrong spot on the pcb? If so, t

Immersion white tin wave soldering problem

Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax

What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S

gold wire bonding

Electronics Forum | Thu Dec 29 10:47:05 EST 2005 | Chris

The paper Dave posted the link for is great. I have to go back and read it in depth. I can build prototypes by wirebonding to ENIG. I can do it on a manual wirebonder but I don't have the patience to do it on a magazine to magazine automatic machi

SMT termination visual and solderability issues.

Electronics Forum | Tue Feb 14 13:16:49 EST 2006 | Carol Stirling

CRITICAL DILEMA! Has anyone run into the problem described below and if so, what was the fix (besides not dealing with this Supplier)? Also, we do not have component manufacturing process experience. We are purchasing a surge resistor that function

First documented case of tin whisker formation

Electronics Forum | Thu May 11 13:28:49 EDT 2006 | patrickbruneel

Being a typically efficient Swiss based company Swatch started the task of RoHS conversion a year ago. After 2 years of intensive research they implemented the process in mass production in June 2005, they started shipping and found massive problem

Wave Solder - solder bubbles/outgassing??

Electronics Forum | Tue Nov 21 19:23:15 EST 2006 | greg york

Had exactly the same problem the other week. Baked some boards did improve slightly but not convincingly. Washed bare PCb and found excessive HASL fluids left on board from improper rinsing and problem disapeared. Baking HASL fluid out is impossible

DEK pro-flow

Electronics Forum | Mon Feb 12 21:38:38 EST 2007 | DEK Answer Guy (PR Dept)

Technical Papers) -ProFlow� upgrades (MPU's). -Paste Low Optimisation -Adjustment of the Print Carriage to ensure Squareness to the Stencil -Replacement of Hinge Pin Assembly -Conversion of ProFlow� to Horizontal Mount -ProFlow� Guides for Operators

Reduce PCB pad area on fabricated boards

Electronics Forum | Sun Oct 27 10:22:43 EDT 2013 | davef

UV Nd:YAG Laser--> Excimer Laser: An increase in system capabilities & ablation quality * CO2 Laser-->UV Nd:YAG Laser--> Excimer Laser: A decrease in processing speed and relative increase in manufacturing cost Laser ablation equipment suppliers: *

Lead Lift in QFP

Electronics Forum | Sat Jul 22 13:20:35 EDT 2023 | shrikant_borkar

Dear Abhishek, I too got the opportunity to investigate this defect Lift lead for SOT. Lead lift in IC, and SOT can occur due to various reasons. Here are some possible reasons for lead lift and ways to avoid them: During the assembly process, mecha


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