Electronics Forum | Thu Nov 30 21:13:55 EST 2000 | Dave F
Can't find "WS601" on the Alpha site. What is that stuff? So, with nothing to go on, I'll just guess ... Yer probably cold welding the solder particles together. The nozzle size (inside diameter) determines the dot size. * With glue, small dot si
Electronics Forum | Tue May 29 12:35:36 EDT 2001 | genny
Dave, Sorry to drag this out some more. When I saw this thread I realized that we often get PWB's fabricated with a gold plated edge connector tab. However we have not ever given any specs to the fabricator regarding the gold plating - all we say i
Electronics Forum | Fri Oct 16 00:18:35 EDT 1998 | Jim McCarten
I would not expect 30 microns to be good enough for flip chip. Maybe I have it wrong, but isn't that +/- 1.5 mils? With bumps on flip chip approaching 3 or 4 mils, I would stay away from a 30 micron machine! | |John, | | Why do not you consider t
Electronics Forum | Fri Aug 17 01:40:55 EDT 2001 | V.RAMANAND KINI
We are in the watch & clock Business. We have a Watch IC chip that has to be wirebonded using Ultrasonic aluminium wedge bonder. The wire dia is 1.25mil. The PCB is made of G10 Glass epoxy copper clad laminate. The copper thickness is 18 microns. The
Electronics Forum | Mon Nov 25 09:06:15 EST 2002 | jax
You might want to check the tin thickness. I believe you have a minimum of .65 microns in order to achieve a good solder joint through 3 thermal passes. In an immersion tin process, the ability to solder is time and temperature dependant. As the int
Electronics Forum | Wed Sep 03 16:59:13 EDT 2008 | glennster
At a former employer we required HASL thicknes to be a minimum of 0.75 micron (30 microinches), as measured at the thinnest point on any given pad. This would generally assure a minimum 1 year solderability shelf life. Usually when we saw a soldera
Electronics Forum | Mon Feb 16 22:34:24 EST 2015 | anvil1021
WEll unfortunately I know the answer to your dilemma all too well and I will make it easy for you. The Koh Young takes a miracle to program and the Mirtec has a superior software and 3D system when you have the MV9 system. Just to day I was measuring
Electronics Forum | Tue Aug 28 14:21:39 EDT 2001 | Scott B
You have to be careful here. The figure is expressed as placement accuracy, not process quality therefore 3 sigma does not relate to 2700 PPM defects but 2700 parts per million placed outwith 15microns (0.0006" / 0.6thou). Extrapolating the distribu
Electronics Forum | Wed Oct 07 06:22:23 EDT 1998 | Charles Stringer
| I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the remainin
Electronics Forum | Thu Oct 08 07:04:54 EDT 1998 | JGodfrey
| I am trying to find out, what possibilities I have, to print solder paste on a board, when the task is to have 120 Microns thickness for the biggest part of the board (85% of the real estate), and then have 250 Microns of thickness on the remainin
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