Electronics Forum: mike (Page 91 of 118)

Re: Through holes in SMT pads

Electronics Forum | Thu Jul 08 15:38:27 EDT 1999 | Earl Moon

| Thank you all for your replies. Thanks to your replies and backup from the IPC-SM-782A (section 3.6.3.2) and James Blankenhorn's "SMT Design Rules & Standards," the designer has agreed to provide adequate clearance between the via and the pad. |

Re: Exhausting of flux in reflow ovens

Electronics Forum | Fri May 14 15:03:19 EDT 1999 | lima

| | Does anyone know of any industry guidelines for the exhausting of volatiles in reflow ovens? I've seen some numbers like 1,000ppm for the oven atmosphere, but is this typical? | | | | My concern is the volatiles in my WS629 solder paste may be

Re: Siemens Reliability

Electronics Forum | Fri Mar 05 15:52:03 EST 1999 | Scott Cook

| We are currently looking into purchasing a high volume, medium mix production line. We are considering several different vendors and I would like to know if current users of Siemens equipment are happy. Are the machines maintenance intensive? Ho

Re: BGA and Gold Boards

Electronics Forum | Thu Jun 25 09:53:04 EDT 1998 | Earl Moon

| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | Mike, | You

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 14:25:24 EDT 1998 | Earl Moon

| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | There has b

Re: BGA and Gold Boards

Electronics Forum | Fri Jun 19 10:03:46 EDT 1998 | Earl Moon

| Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | Mike Mike, We and ind

Re: MoonMan rantings in SMT Express

Electronics Forum | Fri Sep 17 10:21:08 EDT 1999 | Brian

| | | Good people, and bad or otherwise afflicted, | | | | | | For those of you having enormous time avaialable to read my rantings in the SMT Express, please pardon the font situation. It ain't my fault, maybe, and Mike is not to blame. Something g

Re: Off Pad Printing

Electronics Forum | Wed Jun 30 10:00:33 EDT 1999 | Mcox

| | | | | | | | snip | | | | | | | | | John and Dave, | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the pa

Re: Off Pad Printing

Electronics Forum | Wed Jun 30 11:07:16 EDT 1999 | Earl Moon

| | | | | | | | | | snip | | | | | | | | | | | John and Dave, | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us d

Re: Vision Inspection Systems

Electronics Forum | Thu Apr 30 17:03:45 EDT 1998 | Ray N. Lopez Mata

| | | | | | | Hello - | | | | I am interested in obtaining information on the possibility of integrating a Vision Inspection System with an SMT line. I am aware of systems which may be used to gather placement data and such, but are there any system


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