Electronics Forum: mil- (Page 121 of 200)

Universal GSM1 with Shuttle

Electronics Forum | Fri Sep 23 09:53:33 EDT 2005 | PWH

Thanks all for the opinions. Our shuttle/GSM1/PTF install was done by an ex-UIC engineer. Have never utilized shuttle so appreciate the advice on pros and cons of it all. We have 1.0 mil on PTF side and 4.0 on shuttle side. C4 head on both sides

cap size and copper thickness vs part size questions

Electronics Forum | Mon Nov 07 11:26:23 EST 2005 | CW

How large of chip capacitor can we use reliably? I��ve heard they tend to crack. I��ve also heard if you pre heat the larger chip caps (1812 and above) before vapor phase reflow, they won��t crack. If I use 2 mil copper for a power supply board, a

Coating under Mil connector....

Electronics Forum | Thu Dec 22 16:12:51 EST 2005 | chunks

Off the Cuff Answer: Wow, nice big ugly connector! Thought we were the only ones using these things designed during the Korean war. Actually it really depends on the customers print. If they want conformal coating, they should know exactly where

Conformal Coating in New England

Electronics Forum | Fri Jan 13 06:54:12 EST 2006 | pjc

Here's a couple more: Vitek Coating Div., Vitek Research Corp. - Derby, CT - Contact Service Company Company Profile: Parylene Conformal Coating Services With Plasma Surface Treatment To Enhance Adhesion. Electrostatic Powder & Liquid Coating Of Med

How can I measure the consistence of glue application in a Gemin

Electronics Forum | Tue Mar 07 14:03:45 EST 2006 | slthomas

The cheapest method I've found to measure anything in that size range is a reticle for a stereo microscope. I don't remember the resolution but it was 2 or 5 mil, I think. It's not rocket science but it's a nice tool for small scale measurements tha

Gold Flash with QFN28 problem

Electronics Forum | Thu Mar 30 10:21:44 EST 2006 | Dan

Sorry about that(My bad), they are copper. I believe the same thing, we need to reduce the appatures as we are already at 5mil. Our main problem is the customer...Their tests were failing and for some reason they touched that part up, and then the un

DC-DC Converter with solder ball package

Electronics Forum | Fri May 26 16:24:45 EDT 2006 | Jak

Due to spacing issue, we are considering using power bricks with tin/lead solder ball instead of PTH package. The solder ball is 40 mil diameter. Our CM suggested they do hand place since the pick and place nozzle cannot pick up and hold the part due

SUPER THIN PCB BOARD

Electronics Forum | Thu Jun 08 22:54:31 EDT 2006 | hunghung

Dear all, If a PCB board, 2 mils of core with 1oz copper at the top and bottom, is it a good board to be fabricated? will it be caused warpage during etching for inner layer process? if yes, what is the real factor caused to warpage? How to solve t

BGA Vs. QFP

Electronics Forum | Thu Jun 29 08:41:24 EDT 2006 | russ

I agree that a BGA may be the better/easier process overall, but it is not 3 dollars per assy better, I am in agreement that you should be able to handle QFPS just as well as a BGA. PBfree BGAs do not self align BTW, so one needs to keep that in mi

Imm Silver & Screen Printing

Electronics Forum | Mon Jul 31 11:27:15 EDT 2006 | Chunks

I am printing convention leaded paste on onto Immersion Silver board. Board has 16mil fine pitch devices. I am having a problem getting the print to stick to board. Or I am having a problem with the stencil. Never experienced this with jobs befor


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