Electronics Forum | Fri Dec 18 09:07:24 EST 2009 | tommyg_fla
dave, where I work they are having the same problems with 1B31 acrylic. The coating thickness is 6-8 mils dried so that have to do several passes with an air dry between them and a final oven cure. They think that it might be related to the heating r
Electronics Forum | Tue Jan 26 10:26:54 EST 2010 | bandjwet
Dear SMTNetters: Based on your experiences is it really necessary to have today's YAG laser-fabricated stencils electropolished? I undertsand that this "requirement" is a carry-over from the days of CO2-fabricated lasers where the hole wall quality
Electronics Forum | Wed Apr 21 14:52:39 EDT 2010 | joeherz
I'm looking for a handheld barcode scanner that will handle high resolution 1D and 2D symbologies. Some of our 1D codes are down to 3.3mil lines and your average scanner can't reliably scan that resolution. I've used PSC and Wasp equipment before b
Electronics Forum | Wed Apr 21 17:34:48 EDT 2010 | stepheniii
Does it have to be one for both 1D and 2D? We scan barcodes we print with a 200 DPI printer which works out to 5 mil wide lines with no problem. 2D barcodes need a completely different kind of scanner. I know there are scanners that can do both but
Electronics Forum | Tue Jul 06 12:25:54 EDT 2010 | isd_jwendell
I agree, setting a standard for the pcb fab shop is good. I use a fiducial a little smaller than the spec you mentioned, I use 30 instead of 40 mil, which is the minimum recommended for my machine. The rest of the spec (SMEMA Standard 3.1) appears th
Electronics Forum | Thu Sep 02 16:55:31 EDT 2010 | markgray
I ment LF318. We have a power supply board that has 3 different types of these LGA's and i have had great success with the reductions and stencil thickness mentioned. We had to go with 4 mil stencil due to the consideration of the other large compone
Electronics Forum | Tue Dec 21 11:49:33 EST 2010 | remullis
1st the buyer shouldn't control the process based on cost. Let them buy stuff and stick to that. 2nd, I do think leveling in th HASL process is important. If you have high spots on pads for fine pitch your wiping away more of that aperture than othe
Electronics Forum | Mon Sep 12 05:43:53 EDT 2011 | aungthura
Hi All We have run the Hast Burn-in-Board into 2 soldering Process,first-Reflow and second-Wave. After wave soldering, there are many insufficient solder in the via holes.The via holes are wide as 15mil. Then, as customer's request, we have to cover
Electronics Forum | Mon Apr 09 20:55:46 EDT 2012 | action_101
I forgot to add that we are using a 3 mil stencil. It seems like to me that may be there isn't enough flux left when we reach liquidous?? About half of the solder spheres do melt and wet on each pad, but the top half of each solder joint is just the
Electronics Forum | Wed Apr 18 16:13:43 EDT 2012 | tomzee
Hello All. First time poster. I need to design a PCB which will include a Bumped-die type chip with 6mil (152.4 um) pad pitch. I read somewhere that FR4 type board may not be a good choice for such small footprint. I have not had to deal with board
