Electronics Forum: mil- (Page 131 of 200)

Re: bare board problem

Electronics Forum | Fri Jun 18 10:24:12 EDT 1999 | John Thorup

| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an

Re: Lo Behold Voids!!!!

Electronics Forum | Thu May 20 22:42:19 EDT 1999 | Dave F

| hi everybody, | We've been doing some studies on assembly of CSPs. We assembled these packages on micrivia-in-pad patterns. These are 15/13.5/11 mil pads with 6 mil design microvia, using photo/laser/plasma tech. We are seeing voids, as big as the

Re: BGA Voiding Problem

Electronics Forum | Sun Apr 25 11:37:51 EDT 1999 | Earl Moon

| We are just starting to manufacture a PCB with a .039" fine-line PBGA. We are currently seeing voids, mainly in the center, that are as much as 45%. We also intermittently see the corner balls of the PBGA smaller than the center balls. We are using

Re: Squeegee Speed

Electronics Forum | Fri Feb 19 13:54:22 EST 1999 | Tuffty

| Hey all- | | My question is this: My stencil printer operator has said that he has to | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 | paste with

Re: Squeegee Speed

Electronics Forum | Sat Feb 20 23:08:36 EST 1999 | GORDON DURPHEY

| Hey all- | | My question is this: My stencil printer operator has said that he has to | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 | paste with

Re: Print Height Variation

Electronics Forum | Thu Feb 11 09:45:06 EST 1999 | Dave F

| | | Helo, | | Is it common for actual print height of solder paste to exceed the stencil thickness. For example If the stencil is 6mill thick and the actual height of the print is apx. 10 or 11mill. What causes the paste height to be greater t

Re: 20 mil pitch applications

Electronics Forum | Fri Jan 08 16:48:13 EST 1999 | Earl Moon

| Our company is beginning to delve into some 20 mil applications and I'm curious to hear what kind of success others have had placing these components. What kind of fall out rates we might expect or any specific difficulties encountered and what ac

Re: Pretty dirty pictures

Electronics Forum | Mon Sep 28 13:16:58 EDT 1998 | Earl Moon

| | | Does anyone out there have any pictures (jpeg preferred) of solder paste prints - or know where some are available. It will be awhile before our 35mm camera for our 3D scope arrives and I need some for inspection criteria. I need the good, bad

8 mil pitch lead frame Device? Where?

Electronics Forum | Sat Sep 12 10:47:00 EDT 1998 | Jon Medernach

I am aware that the Intel processor is available in a 0.012" leadframe, as a TAB product ( which can be excised and placed with may P&P machines but I do not know of any 0.008" leadframes, Bumped Die are at these pitches and frankly I would bet dime

DFM Guidelines

Electronics Forum | Wed Aug 12 00:01:56 EDT 1998 | Peter

I have a customer who is transitioning from 100% thru hole boards to designing boards with smt components. We gave them our basic DFM guidelines and they have laid out 2 boards following these guidelines. When I saw the result of their first pass, I


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