Electronics Forum | Thu Sep 30 12:29:01 EDT 1999 | Dave F
| Hi everyone, | | Greetings! | | I�ve got a 2-layered through-hole PCB�s having the following problems: | | Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB | Insufficient Solder and some solder ne
Electronics Forum | Thu Sep 30 21:37:44 EDT 1999 | Dreamsniper
| | Hi everyone, | | | | Greetings! | | | | I�ve got a 2-layered through-hole PCB�s having the following problems: | | | | Solder Mask peels after wave soldering at random locations and only at the bootom side of the PCB | | Insufficient Solder an
Electronics Forum | Fri Jul 30 17:13:30 EDT 1999 | Dave F
| | | Looking for solder paste specification limits which have reliability data to support them. Currently, we are looking to define the min/max volume necessary to ensure a good joint on CBGA, PBGA, and Micro-BGA's. Any information will be greatly
Electronics Forum | Wed Jul 21 11:49:24 EDT 1999 | Deon Nungaray
| | | | I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk
Electronics Forum | Wed Jun 30 13:48:57 EDT 1999 | JohnW
| | | | | | | | | | | | snip | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as ot
Electronics Forum | Wed Jun 30 15:24:23 EDT 1999 | Earl Moon
| | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable res
Electronics Forum | Wed Jun 30 17:52:06 EDT 1999 | JohnW
| | | | | | | | | | | | | | | | snip | | | | | | | | | | | | | | | | | John and Dave, | | | | | | | | | | | | | | | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on cons
Electronics Forum | Fri Jun 04 10:02:06 EDT 1999 | Chrys Shea
| | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole
Electronics Forum | Fri Jun 04 17:10:59 EDT 1999 | C.K.
| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI
Electronics Forum | Fri Jun 04 17:26:11 EDT 1999 | C.K.
| | | | Geez, those test guys are always whining about via holes, aren't they? I even had one test guy go over to our finals/add-on department and instruct everone to look for unfilled vias and fill them by hand! Without consulting the area manage
