Electronics Forum | Thu Jun 10 12:10:41 EDT 1999 | Earl Moon
| | | I am starting a new project which involve 3 oz copper layer with 20 mil components on the top of the board and 0.040" thick copper with D2Pak on the bottom of the board. | | | There is anybody has experience on metal-based PCB reflow process?
Electronics Forum | Sun May 23 07:13:56 EDT 1999 | Scott Cook
| Has anyone had any experience or data using vibration during the reflow process. | We introduced a vibration device attached to the fixed rail on a Vitronics reflow oven. The reason was to prevent skewing on large PLCC devices. The process worked v
Electronics Forum | Fri Oct 16 09:12:46 EDT 1998 | Scott Cook
Sorry folks. I'm just a naysayer here. Let's look at this BGA thing...... We've all been successfully processing down to 16 mil FP stuff for years, now--some of us down to 11 mil. Once the printing process was stabilized, paste rheologies were matur
Electronics Forum | Sat Oct 17 10:43:29 EDT 1998 | smd
| Sorry folks. I'm just a naysayer here. Let's look at this BGA thing...... | | We've all been successfully processing down to 16 mil FP stuff for years, now--some of us down to 11 mil. Once the printing process was stabilized, paste rheologies were
Electronics Forum | Thu Mar 05 13:17:19 EST 1998 | Justin Medernach
| Hello everyone! | Does any know anything about bare board size variations? | Is there a spec. or tolerance? | I'm running small lots of boards and during the screen printing process | I find that I cannot paste each board perfectly.I've tried other
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Thu Feb 17 11:38:53 EST 2000 | Steve Thomas
We appear to have solved a major reflow process problem (poor quality joints on a 20 mil QFP100...excessive solder left on the lead leg, not much left for a joint) with a design change to the board. We gave ourselves considerably more room for a hee
Electronics Forum | Tue Feb 15 11:48:30 EST 2000 | Steve Thomas
Thanks for your responses, gentlemen. I'm really just looking at options, and frankly, being a novice at this stuff I'm looking for the info. required to make a semi educated decision. You, kind sirs, are my educators. And that probably scares m
Electronics Forum | Mon Feb 14 20:55:19 EST 2000 | Thomas Ravener
You need to decide what types of processes you need to run right now. What is the mix of different devices and what volume is required for each product. Are you doing a mixed technology board (SMT & PTH) or just SMT. Are there fine pitch devices (und
Electronics Forum | Tue Nov 28 13:21:33 EST 2000 | Graham Naisbitt
Terry The SCC3 product is a vinyl modified silicone. It is less able to perform at low temps as it becomes brittle. It is not easy to repair because it is essentially silicone. It is not a qualified material to the MIL-I-46058 Spec. Are you sure yo
