Electronics Forum: mil (Page 171 of 200)

Re: Printing and Reflow with Ceramics

Electronics Forum | Thu Aug 13 07:53:40 EDT 1998 | Earl Moon

| | Couple of questions. | | 1) Are we talking alumina substrates as the ceramic material? | | 2) Are we co-firing gold as the conductors on the substrate surface? | | 3) In other words, is this a hybrid thick film circuit? | | 4) If so, how large or

Re: Solder Balls

Electronics Forum | Fri Aug 21 13:43:13 EDT 1998 | Ben Salisbury

| Hello everyone, | I am currently running a gold plated SMT board and am experiencing tiny solder balls between the pads and the masking between the 20 mil pitch devices. I'm looking at these boards with a 60x microscope. IPC-610 say's any visible s

Re: solder thief guidelines

Electronics Forum | Tue Aug 04 12:15:33 EDT 1998 | Steve Gregory

| | | | I am looking for some design guidelines (length, width, spacing) for solder thieves which are placed behind trailing pins of wave soldered SOICs. I'd appreciate it if some one could direct me to the appropropriate reference. | | Also, has an

Re: Solder on gold finger

Electronics Forum | Tue Aug 18 12:02:59 EDT 1998 | zambri

| Hi, | Need some advice on how to eliminate or reduce the solder on finger that we are having right now. So far what we understand is that 90% of the problem is due to the reflow process where solder traps in vias causing explosion when subj

Re: Solder on gold finger

Electronics Forum | Mon Jul 27 21:10:10 EDT 1998 | D.Lange

| Hi, | Need some advice on how to eliminate or reduce the solder on finger that we are having right now. So far what we understand is that 90% of the problem is due to the reflow process where solder traps in vias causing explosion when subj

Re: Water Quality in the Water Wash, IPC Standard

Electronics Forum | Sat Jun 13 07:08:46 EDT 1998 | Dave F

| Is their an IPC standard for the water that is being used in the water wash. I have been looking and at this time have not found any thing. Steve: A lot of the old command and control specification environment has changed with the "industrializati

Re: Who's Who's in Screen Printers for Contract Manufactuers

Electronics Forum | Thu Jun 04 22:47:58 EDT 1998 | Dave F

| My company recently purchased 3 new Phillips CSM machines and is interested in buying a Screen Printer. The one problem we have is that we have to change setups three to four times a day. Due to the small runs of one type of boards that we do. My

Re: Who's Who's in Screen Printers for Contract Manufactuers

Electronics Forum | Mon Feb 01 15:18:58 EST 1999 | doug clement

| | My company recently purchased 3 new Phillips CSM machines and is interested in buying a Screen Printer. The one problem we have is that we have to change setups three to four times a day. Due to the small runs of one type of boards that we do.

Re: Surface Mount Solder Balling

Electronics Forum | Fri May 29 15:17:14 EDT 1998 | Ryan

| Thanks Steve- Here is the whole story: The solder balls are appearing all over, similar to a splatter. They are relatively small. We are using H-Technologies S-HQ no-clean solder paste. The stencil is 6 mil and the boards are running in a ABW

Re: SM Headers & Connectors

Electronics Forum | Wed Apr 08 12:29:08 EDT 1998 | Justin Medernach

| Is it just me, or does anybody else have problems with open connections on small surface mount headers and connectors? I am talking about small 20 to 40 pin devices, 25 to 50 mil pitch. We put these things on the board, the feet look like they ar


mil searches for Companies, Equipment, Machines, Suppliers & Information

fluid dispenser

Stencil Printing 101 Training Course
2024 Eptac IPC Certification Training Schedule

High Resolution Fast Speed Industrial Cameras.
Void Free Reflow Soldering

World's Best Reflow Oven Customizable for Unique Applications