Electronics Forum | Mon May 24 13:11:12 EDT 2010 | deanm
A guideline that I use agrees with MikeS: For 20mil pitch, apertures should be 9-10mil with a stencil thickness of 5-6mils to achieve an acceptable aspect ratio of 1.7. Just be sure you are using a mesh Type 3 or 4 solder paste. Otherwise, larger par
Electronics Forum | Fri May 16 17:15:16 EDT 2014 | edwardt
Desire to push the spacing limit as usual. If I place two 0402 components spaced 7mils between the edge of the two components adjacent pads, which allows for 4mils solder mask webbing between component pads, what would the risk be? Potential for sold
Electronics Forum | Tue Oct 28 18:58:05 EDT 2014 | rangarajd
You might want to consider using a stepped stencil. We have tried using a 5 mils with an increased aperture size to compensate for the lost solder volume, if you were to use a 6 mils. While the yield was good, we'd still get random opens. With a 6 m
Electronics Forum | Mon Dec 02 08:43:20 EST 2019 | scotceltic
What are people using out there for minimum spacing between vias ? We recently came across a PCB manufacturer that wants us to increase our spacing due to their process. Below is our current spec. that we follow. Spacing between via pad to via pad o
Electronics Forum | Thu Feb 24 11:05:53 EST 2000 | Russ
I usuallly like to have the pad size the same size as the ball up to +2mil, the pcb solder mask opening to be +4 mil from the pad size (I have found this to aid in Xray inspection for opens since you can see the little tail of the solder wicking up t
Electronics Forum | Mon Nov 13 04:57:27 EST 2000 | Wolfgang Busko
Hi Richard, I assume that you deal with a component that has 20mil pitch. In this case depending on your pad design you get from 8 to 10mil spacing for your apertures. With a slight reduction of the aperture (10 to 15% for avoiding shorts)and a 6mil
Electronics Forum | Thu Sep 30 06:47:51 EDT 1999 | park kyung sam
| My stencil thickness is 6 mil and we got qfp's with fine pitch. | how many percent should i reduce my stencil aperture using a 6 mil stencil for 0.5 mm pitch and 0.4 mm pitch ? | | thanks | we have placed 16 mil components for 3 years. why don't
Electronics Forum | Mon Feb 23 15:10:02 EST 1998 | justin medernach
| Stencil Opening | Looking for spec or any info to specify stencil opening for TSOP48 20mil that will consider also thickens and direction of printing, if applicable Ron, Use a six mil foil thickness for your stencil. Go one to one with your apert
Electronics Forum | Tue Jun 17 08:52:39 EDT 2003 | russ
Aspect ratio = width of aperture divided by height. E.G. 6 mil stencil at 9 mil wide = aspect ratio of 1.5. Value should be 1.5 min. Area ratio - use when length and width of pad are roughly same dimension like for BGAs and 0805 and smaller R-nets
Electronics Forum | Thu Sep 01 18:27:28 EDT 2005 | Board House
Hi I currently Manufacture product for Dataradio Inc. in Quebec. and would be interested in quoting your product. We are a Multi-layer facility in Minnesota, we currenty manufacture layer counts between 2 & 18 layers. Line widths and Spacing down t