Electronics Forum | Wed Nov 16 12:01:59 EST 2011 | benreben
Hi, for me the best system AOI is SAKI because is not a head with a FOV but is a scaner. this scaner take the image board in a few seconds. This machine have many algorithm for inspect all errors on a board. But the interface is difficult and the pr
Electronics Forum | Fri Jun 15 08:00:08 EDT 2012 | deanm
ENIAC, 0.040" equates to 1mm, not 0.1mm. 0.040" is the IPC minimum recommended fiducial size and when we started putting fiducials on our boards I assumed that all equipment manufacturers should be able to automatically spot that size. Since then I'v
Electronics Forum | Wed Sep 05 16:35:22 EDT 2012 | davef
It depends, but I'd guess that as a minimum the floor clock will start when the component returns to room temperature. It's easy to argue that the floor clock starts earlier than that!!! Probably, the floor clock starts a couple degrees lower than th
Electronics Forum | Fri May 24 09:16:36 EDT 2013 | grahamcooper22
you need to reduce your time above liquidus to as low as you can...maybe 10~30 secs to allow the solder to wet to the gold but minimise the amount of gold that is dissolved into the solder joint...try also reducing the peak temp to 200~210 deg C. Thi
Electronics Forum | Tue Jul 22 21:49:10 EDT 2014 | edriansyah
OK/NG will cost you a licence update, but it is powerfull. You can used the area color algorithm, as an alternative Black and Green have different RGB value, so it will not be mixed. You will need to tune it for a few board, set the minimum and maxim
Electronics Forum | Mon Dec 22 15:41:27 EST 2014 | benreben
why all people speak only the temperatur? the speed convoyor is very important too... with lesser zone of reflow you can lower the convoyor speed... but if i must speak about temperature and zone i think the minimum for solder all board in ROHS is 5
Electronics Forum | Mon Feb 09 07:55:16 EST 2015 | jax
Without knowing the surface finish of the PCB lets focus on an alternative problem... At a minimum, you need to look at the 1/2 built assembly like individual components, all having their own MSD levels and all subject to 2nd side reflow temperatures
Electronics Forum | Fri Feb 19 15:23:31 EST 2016 | ttheis
RESOLVED I adjusted the "Minimum Board Width" in the Board Handling Configuration to resolve this issue. I set the lane width to a larger value which did not hit the front limit and measured the difference between the actual lane width and the set l
Electronics Forum | Thu Jan 19 11:10:13 EST 2017 | rgduval
I'd start by checking the manufacturers documentation, and seeing if they have any application notes regarding reflow recommendations for the part. But, in general, make sure to bake the parts prior to assembly, they are notoriously moisture-sensiti
Electronics Forum | Thu Apr 20 01:58:15 EDT 2017 | rob
Personally, I try to keep them to a minimum, as if we put conveyors between the SMT machines I find less effort is made on automating awkward components - it's so easy to add a hand fit operation. We run Loader-Printer-Conveyor-3xSMT-Conveyor-Oven
.gif)
