Electronics Forum | Wed Jan 24 11:27:54 EST 2007 | bradlanger
We have been using SN100C lead free hasl for over a year now with good success. It is very solderable and has good shelf life. You do have to make sure the finish gets applied to the correct thickness. If the lead free hasl finish is not applied thic
Electronics Forum | Wed Mar 28 09:25:53 EDT 2007 | SWAG
Yes, pre-loaded feeders is the best way. If you do not have that option as you are high mix or do work for different companies that have many different part numbers, I would guess that your printer will take about 15 minutes to get ready, each HSP f
Electronics Forum | Fri Jun 02 14:42:06 EDT 2023 | tommy_magyar
"If for example a customer requested assemblies but never specified their requirements, would MFGs be expected/required to follow parameters from a specific class related to the end use of said product?" Answer: The customer placed an order with you
Electronics Forum | Thu May 17 07:36:40 EDT 2001 | Bob Willis
Here is a copy of a draft document on PIHR Inspection I have jotted down on a flight to Scotland yesterday, any comments suggestions etc ? I have already most of the photos for the standard but as you know there is nothing in the IPC document it just
Electronics Forum | Tue Dec 14 22:17:33 EST 1999 | Dave F
Armin: How ya doin� bud? CK gives good advice, but I'd like to take a bit of a different angle. Q1. For 0.7 mm (0.027in) diameter hole for vias, what�s the minimum annular ring for this hole diameter? Depends on what you�re trying to do. For in
Electronics Forum | Wed Aug 09 16:30:43 EDT 2000 | MarkS
Has anyone had (successful) experience placing testpoint vias under BGAs? We already have conventional vias, but we're contemplating converting them into testpoints (probably by enlarging the bottom-side copper diameter to .036" and opening the bott
Electronics Forum | Tue May 16 16:32:38 EDT 2000 | Ashok Dhawan
1) I had downloaded ANSI/ESD-S20.20-1999 from www.eosesd.org web site. I am not clear whether section 6.2.3.2 is correct. It states that " All process essential insulators that have electrostatic fields that exceed 2000 volts should be kept at a mi
Electronics Forum | Fri Apr 14 13:30:20 EDT 2000 | Murad Kurwa
Hi All: Can you tell me specifically if you converted an exiting product made with Clean process using WS609 or compatible to 'No-Clean' process. We have to convert assemblies from current clean process at a CEM to No-Clean process in our own factor
Electronics Forum | Tue Feb 27 03:35:23 EST 2001 | peterbarton
Steve, I have to support the comments made by Dave F. Provided the surface mount parts on the second side are correctly orientated and not too close to any adjacent through hole leads then the best option has to be to print glue then wave solder. T
Electronics Forum | Wed Apr 11 06:06:53 EDT 2001 | wbu
Hi Dreamsniper, the IPC land design standard is IMO a good reference. If you use the online calculator you can influence the result by varying for example manufactoring parameters. For the same lead width and same tolerances (and of course pitch) we
