Electronics Forum: missing and fillet (Page 1 of 14)

solder fillet peeling update....

Electronics Forum | Mon Jul 14 12:24:02 EDT 2003 | MA/NY DDave

Hi So Steve, I must have missed something from your last subject topic. "solder fillet peeling" Are you saying you or they, Ultrasonic Clean for 20 to 30 minutes after soldering and that is suspected as causing the cracking at the top of the compo

LED (Seven Segment) found with missing segment and dimmer

Electronics Forum | Wed Jul 20 03:10:45 EDT 2011 | umar

I have mount the 8 pcs SEVEN SEGMENT LEDS on the PWB side at SMT Process, after reflow the board test at customer side and facing some issues which is missing segment and also one segment founded dimmers compare to other segment. Data sheet of LEDs

LED (Seven Segment) found with missing segment and dimmer

Electronics Forum | Wed Jul 20 08:40:27 EDT 2011 | mosborne1

Umar - This is usually seen when the lead frame in the die attach is cut with a diamond saw instead of a lasar. We have seen this problem years ago from HP 7 segment displays. If you have Enviromental box (tenney box) you can temp cycle them from 0 d


Electronics Forum | Tue Jul 09 15:20:19 EDT 2002 | pjc

When you look at the capabilities of Combo machines they tend to sacrifice performance when compared to separate X-ray and AOI machines, meaning they don't do either the X-ray or AOI operations as well as a machine that was designed to do only one. A

lead free platings and tin lead

Electronics Forum | Tue Aug 31 21:45:49 EDT 2004 | KEN

I have experienced this directly in SMT and wave solder. Fillet lift (can) be a direct indicator to lead enrichment (but its not the exclusive symptom). Lead enrichment in smt joints reduces the interfacial strength shortening the time to creep f

YesTech F1 AOI false calls and misses

Electronics Forum | Thu Apr 19 20:01:30 EDT 2012 | eadthem

some things to consider, Is there flux on the board. are there finger prints on the tops of parts. Is the board warped at the V score from reflow Is the board shifting in the machine during inspection. These are the issues we have had with our mir

YesTech F1 AOI false calls and misses

Electronics Forum | Fri Apr 20 14:11:27 EDT 2012 | rway

Programming is different, yes, but so is the terminology. ///with machine vision you have parameters that select what is good and what is bad, and you have parameters that help make bad look worse and good look better making the difference between w

RoHS and stencils

Electronics Forum | Fri Mar 03 14:40:22 EST 2006 | amol_kane

i think a more important issue here would be the reduction ratio. as LF solders have a higher surface tension, they do not flow as well as their leaded counterparts. therefore the stencil design may have to be changed (hence a new stencil) if the red

Pick and place pickle

Electronics Forum | Thu Jun 26 09:56:37 EDT 2008 | gabriella

hello Zonker cheaper versions tws essemtec ivastech heeb fridge autotronik more expensive: mydata siemens juki uic GSM europlacer ipulse assemblion I will definitely miss some, but at least is some place to start.

BGA assembly and inspection

Electronics Forum | Tue Apr 03 01:37:54 EDT 2001 | philipreyes

60% 36% 0f ball area >36% Class2 Accept Reject 45% of ball diameter >45% 20.25% of ball area >20.25% Class3 Accept

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