Electronics Forum | Fri Jan 27 15:12:48 EST 2006 | GS
From technical point of view: it should not be a problem to mix Pb with Pb Free components soldered with a LF solder process. You have to take care about the max temperature allowed on your Pb components and make sure they can withstand the higher
Electronics Forum | Fri Jan 27 10:58:11 EST 2006 | mafc65
We are running our prduction (TV's)with Lead Free Solder, since 1 year ago, but we still have a lot of Electrolityc Capacitor (Thruhole and SMT)in stock that are for PB Solder. We have to use them before February-06. Do anybody know if there is a pro
Electronics Forum | Mon Nov 14 10:10:52 EST 2005 | davef
When soldering your full tin (no lead) and Pb95/Sn5 solder components, you need to modify your PbSn reflow recipe to compensate for the higher melting point of the changed solder alloy [with your Sn62/Pb36/Ag2 solder paste] on those component leads.
Electronics Forum | Thu Nov 10 08:23:35 EST 2005 | arclightzero
Hello, I am currently trying to isolate internal fallout problems with very low yield substrates mixed with great yields and have recently found that we are using a Sn62/Pb36/Ag2 solder paste with full tin (no lead) components as well as Pb95/Sn5 sol
Electronics Forum | Thu May 25 10:55:21 EDT 2006 | Chunks
Loctite makes a product called MP218 that works well with mixed alloys.
Electronics Forum | Fri Jan 27 18:32:15 EST 2006 | mafc65
Well, most of the capacitor are thru hole, then pcb's goes to adhesive process upsidedown to continue SMT process in which , maximun tempetarure is 120�, so temperature is not problem. About SMT capacitorS, I will check temperature specs before mount
Electronics Forum | Fri Jan 27 17:23:10 EST 2006 | muse95
Watch the solder profiles allowed for these caps. Most electrolytics cannot withstand high heat. Even RoHS compliant Electrolytics are often rated for peak 245C, 3 secs max, for example. Nowhere close to the 260C 10-20 sec you usually like to see.
Electronics Forum | Wed May 24 15:59:34 EDT 2006 | JohnM
I have a product with mixed in Pb free and Pb BGAs. I decide to use SnPb paste with Pb free reflow profile to make it work for both types of BGA. Do I have a reliability solder joint issue by using this method? How is your opinion on this case? Can
Electronics Forum | Wed May 24 19:46:32 EDT 2006 | JohnM
So, it looks like the backward compatible of BGA statement is not guarantee for solder joint reliability. It doesn�t matter what temperature and what melting sequence we have in order to avoid the solder void issue. Is Pb diffused homogeneously thr
Electronics Forum | Wed May 24 16:19:58 EDT 2006 | inds
John, there have been quite a few discussion on Mixed Assemblies in this forum.. do a search.. you will get whole lot of information.. in addition - IF you are using Lead-free reflow profile...make sure the rated temp for Sn-Pb components is not vi
