Electronics Forum | Mon Oct 22 15:30:57 EDT 2001 | Basaran
Is there anybody in this forum who is using TI DSP 320C6203 modules for communication devices. I would like to know if anyone has problems with Solder bump- Ni pad interface delamination or problems with signal quality.? Cemal Basaran
Electronics Forum | Thu Oct 25 16:48:29 EDT 2001 | Cemal Basaran
We can inspect and measure strain field in anything larger than 320nm with Laser techniques we have. We can do this measurements during fatigue testing. Of course thick intermetallic region as a solid region is a problem due to the fact that you ha
Electronics Forum | Mon Oct 22 17:47:47 EDT 2001 | davef
We on SMTnet have danced around this component package, but there is not a "background" of knowledge in the fine SMTnet Archives. We in our company use this component package, but have not seen the problems you discuss. [We see other problems.] Th
Electronics Forum | Tue Oct 23 09:09:27 EDT 2001 | Cemal Basaran
What is the reflow temperature you use to attach this package to your PCB.? I did extensive study on this package and compared it with other packages. I used our own Moire Interferometry, SEM, EDX studies. In my opinion the problem is TI does not man
Electronics Forum | Thu Oct 25 21:04:18 EDT 2001 | davef
You are correct. So, the unit amount of gold [based on IG plating thickness, size of the pad, etc.] dissolves in the solder very quickly. When the solder is liquid for: * A long time, the gold disperses more. * A short time, the gold concentrates a
Electronics Forum | Wed Oct 24 11:14:44 EDT 2001 | Cemal Basaran
Dave; Thanks for responsding so fast. here are my answers. 1-WOW!!! How do people get these cool toys? I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the
Electronics Forum | Tue Oct 23 20:27:06 EDT 2001 | davef
WOW!!! How do people get these coo toys? Comments are: * IPC-7530 is not a specification. It is merely a guideline. [IPC-7530 �Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave)�] * What makes you say a 20-micron intermetall
Electronics Forum | Wed Oct 24 18:08:02 EDT 2001 | davef
1- DF1: WOW!!! How do people get these cool toys? CB: I am with the University at Buffalo Electronic Packaging Lab. http://www.packaging.buffalo.edu We have pretty much everything that is sold on the market as well as Laser inspection technologies we
Electronics Forum | Wed Feb 03 03:49:56 EST 2016 | webjelen
I have QP242E with two modules MFU-58. I need put tray unit STU1 to Modul2 but optimalization end with error. Module1 is alright. Setting Modul1 and Modul2 is same. Any advice ? Thanks
Electronics Forum | Sun Aug 28 22:19:34 EDT 2005 | sonata06
Origin: China Price: To Talk About Specification: 1)Thickness Of Silver Plating:From 2Um-15Um 2)Material:ABS or PBT 3)Cu-Ni-Silver 4)Earth Module,Profile Module,Profile Switching Module,Disconnection Module,Connection Module 5)Different Colors are
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