Electronics Forum | Fri May 22 16:08:05 EDT 1998 | Steve Gregory
Hi ya' Mike! For low temperature baking, IPC-SM-786A (Procedures for Characterizing and Handling of Moisture/Reflow Sensitive IC's) specifies a low temperature bake that can be done in the component shipping packaging...ya' wanna remove the bubb
Electronics Forum | Wed Feb 01 11:47:07 EST 2006 | Mike
James, If you have a true MSD issue, then baking them AFTER your reflow is not going to fix the issue. I would have to agree with GS and look at trapped cleaner media (if your not No-clean) under the components, or inside connectors. If your runnin
Electronics Forum | Tue Oct 24 08:07:42 EDT 2006 | markb
We are experiencing an issue with RoHS boards delaminating during SMT. In tyring to determine root cause, our board mfg house states the issue is with the laminate. The laminate supplier states that the board house is not taking the proper precua
Electronics Forum | Mon Feb 19 13:04:17 EST 2001 | billschreiber
The ultrasonic frequency used in today�s stencil cleaners is usually a 40 kHz �sweep� frequency (also used on semiconductors and other sensitive cleaning applications). This frequency is not low enough to cause stencil damage (the lower the frequen
Electronics Forum | Thu Aug 19 17:50:49 EDT 1999 | Stu Leech
| | | | | | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large
Electronics Forum | Sat Aug 21 14:35:28 EDT 1999 | Stu Leech
| | | | | | | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does lar
Electronics Forum | Wed Jul 03 11:37:36 EDT 2002 | fmonette
Dason, I apologize if some of the information sounds redundant but I don't think I explained my point very well (and the standard can get really confusing at times). I definitely agree with using C-SAM to look for internal defects. My only advise i
Electronics Forum | Thu Sep 30 15:06:05 EDT 1999 | Dave F
| Guys & Gals, | | I am at present instigating a formal method of recording and tracking any "process" trials that we may wish to run, such as a new paste, different packaged device etc; | | I started with a simple form.....too simple, but now I th
Electronics Forum | Fri Jun 18 11:37:10 EDT 1999 | Earl Moon
| | | | first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pa
Electronics Forum | Fri Jun 18 15:04:19 EDT 1999 | Scott Cook
| Scott, | | I do hurt easy. Be gentle, at least that's what I tell all the women in my life though quickly diminishing supply - oops. I do not happen to believe this statement. I have seen you dodge many a penned "dart" on this very forum. Since I
