Electronics Forum | Sun Apr 25 04:12:34 EDT 1999 | Earl Moon
| At Sanders (Military manufacturer), we have only started using plastic parts within the past few years. After being tasked with reviewing the new J-Std-033, it became obvious to me our process for controlling device exposure is weak. We build very
Electronics Forum | Thu Jun 06 12:54:23 EDT 2013 | emeto
I think that you will be fine. You don't want to crack the part during it's stay on a high temperature in the reflow oven(thermal shock...thermal stress...). Once you mount the part on the board it will collect moisture again, but it is already proce
Electronics Forum | Thu Jun 06 10:38:00 EDT 2013 | boriskilk
Interesting question, we have only seen issues with PCBs and humidity when they are going through reflow. Are you having issues?
Electronics Forum | Tue Apr 27 10:05:36 EDT 2004 | Francois Monette
Hi CT, The bake requirements for Moisture Sensitive Components are defined in table 4-1 of the joint IPC/JEDEC J-STD-033A (link for free download at http://www.cogiscan.com, click on MSD Knowledge Base/Introduction). Normally you pick the highest
Electronics Forum | Fri Jun 28 06:12:27 EDT 2013 | grahamcooper22
If the soldering process isn't heating the whole package up to soldering temp then NO you don't need to keep them DRY (using a soldering iron to fit a QFP for example)....but if the soldering process is done on a rework station or in a manner where t
Electronics Forum | Mon Apr 26 12:51:45 EDT 1999 | Bob
Steve, Moisture sensitivity needs to be taken seriously. Being in the commercial end of electronics now, I am using many plastic packages. Unfortunately, moisture sensitivity processing is not black and white and it does require procedures and dis
Electronics Forum | Fri Jun 07 10:02:01 EDT 2013 | sarason
In thirty years of Electronic service I have never had problems with moisture in boards when hand soldered. I have worked on boards in boxes for defense through industrial control, joy rides etc. Sometimes they some back buried in half an inch of dus
Electronics Forum | Thu Jan 27 20:34:12 EST 2000 | Dave F
Ashok: The real concern about moisture sensitivity is in plastic packaged parts. The plastic packaging used to manufacture surface mount technology devices absorb moisture from the environment. The high temperatures involved in vapor phase/reflow
Electronics Forum | Thu Sep 15 22:23:36 EDT 2005 | davef
Use your board supplier recommendations Specific procedure or guidelines that need to be followed for handling Moisture Sensitive Devices => J-STD-020 & J-STD-033 Is there any paste height/volume requirement for a lead-free process? => You need to
Electronics Forum | Fri Sep 02 05:17:54 EDT 2005 | pyramus
I have another question can anybody assist me. Is there any specific procedure or guidelines that need to be followed for handling PCB (OSP & Immersion Tin)? Moisture Sensitive Devices? or how about throw-out or left over parts? Is there any paste h
