Electronics Forum | Mon Jul 16 12:03:42 EDT 2007 | davef
We're aware of no industy acceptance standard for max moisture content of a board. For more on moisture levels, get a copy of: "Removing Moisture from Electronic Components and Assemblies", CS Leech, Jr, Circuits Assembly, May 1994. The article disc
Electronics Forum | Wed Sep 23 10:42:13 EDT 2015 | ehess
is it necessary to vacuum seal moisture sensitive components? Or can we just seal with desiccant in proper bags?
Electronics Forum | Thu Sep 23 09:59:56 EDT 1999 | Al Carrillo
Hi All, I'm recently receiving an IC in package for Ic's sensitive to moisture and not in another times, Somebody know how can I know if this Is moisture sensitive or not(which is the rule ?)?. the Ic is a soic14. thanks I appreciate your help.
Electronics Forum | Fri Jul 06 10:18:02 EDT 2007 | blnorman
According to IPC-A-600, measling can occur in epoxy-glass boards when the moisture content of the board is above 0.3wgt%. Is this the industy acceptance standard for max moisture content of a board?
Electronics Forum | Wed Sep 23 13:20:02 EDT 2015 | emeto
Depends on the MSL(Moisture sensitivity level) and how far you will use them in production. Here you should be able to get all the answers: http://www.jedec.org/sites/default/files/docs/jstd033b01.pdf
Electronics Forum | Wed Nov 11 22:13:45 EST 2015 | jackzhong
Hi, if you seal in proper way, it is not necessarily to vacuum. we are specialized in moisture solution for electronics and components. Maybe we could give you some workable advice or solutions. If you are interested, contact me by Skype:dryplus1 o
Electronics Forum | Mon Feb 11 13:28:36 EST 2002 | stepheno
We have some BGA's that don't solder very well. They weren't properly stored in regards to moisture protection. The balls look dull and rough. After reflow there seemed to be a diffinate line between the balls and the solder on the PCB's. I think
Electronics Forum | Wed Sep 23 14:30:05 EDT 2015 | deanm
"...air evacuation is not required (Figure 3-5). Light air evacuation may be used to reduce the packaging bulk and enhance carton packing (Figure 3-6). Full evacuation shall not be used as it will impede desiccant and HIC performance and possibly lea
Electronics Forum | Mon Feb 11 20:07:46 EST 2002 | caldon
Stephano- There is a Chemical process to revert the contamination back to its original form. The EMPF Developed it back a few years ago in conjunction with Rockwell and some others. Please contact ACI at 610-362-1200 and ask for Dr. Greg Parks. This
Electronics Forum | Mon Feb 11 21:54:14 EST 2002 | davef
LONG TERM Your plans to buy a vaccuum bag resealer and a batch drying oven sound good as you say, but you�re correct. They will not help with this current situation. SHORT TERM If your connections are clean, free of pits and holes with a smooth,
