Electronics Forum | Mon Jul 17 11:21:05 EDT 2023 | stephendo
Fresh production run? As in starting with BGAs opened from the previous run? And then using BGAs that have been never opened? Look at the balls where the shorts are. They are smaller. You have delamination. I suspect that you have moisture in yo
Electronics Forum | Tue Jul 18 00:45:17 EDT 2023 | stephendo
You don't have people that are fanatics about vacuum sealing do you? There air should be only lightly evacuated. If done like frozen food is done that can isolate parts in pockets. And actually draw moisture into the bag. And cause holes in corner
Electronics Forum | Mon Oct 02 12:43:30 EDT 2023 | daniel_stanphill
I agree with dontfeedphils. Any time we run into a moisture sensitive component that cannot go through our wash cycle, we solder the component(s) by hand after everything that can be washed has been reflowed and cleaned.
Electronics Forum | Tue Oct 10 23:11:04 EDT 2023 | unsung
I've seen these machines flip over and left outside for weeks in the rain, heat, moisture and still work. Doesn't hurt to take clean it up just view the sensors.
Electronics Forum | Thu Mar 21 19:57:54 EDT 2024 | compit
I am looking for a machine to protect PCBs against moisture with varnish. It doesn't have to be very efficient, it seems that one for a desk is enough. What to look for? Is it worth looking for a used one? Best available in Europe.
Electronics Forum | Tue Jan 23 09:03:00 EST 2001 | fmonette
This guideline is actually in the IPC/JEDEC standard J-STD-033, May 1999 (although it is not spelled out very clearly, thus the current confusion in the industry). The technical reason is that moisture diffusion is a very slow process. Once parts ha
Electronics Forum | Tue May 26 15:49:05 EDT 1998 | Earl Moon
| | We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg
Electronics Forum | Tue Apr 13 14:49:15 EDT 2010 | davef
90%) from the sample, and the bake time and temperature specified herein are minimums. To improve test accuracy, or to prevent heat damage, other bake parameters may be AABUS. 2 Applicable Documents IPC-QL-653 Certification of Facilities that Inspect
Electronics Forum | Sun May 17 13:46:30 EDT 1998 | Steve Gregory
Hi All! I've been reading this conversation which prompted me to break out the IPC-SM-786A from the IPC manuals from our parent company in Maryland sent us (we're just starting up in California). It's the Procedures for Characterizing and Handling of
Electronics Forum | Mon Apr 01 20:10:24 EST 2002 | davef
Oh. [Howabout if I smack you?] If ahma connectin� wif whut yer sayin�, you: * Don�t like the appearance of the glue slobberin� out from under the component even though there is no apparent glue on solderable surfaces. * Concerned about the hydrosco
