Electronics Forum: moisture (Page 61 of 135)

Vapour phase soldering - problem

Electronics Forum | Thu Aug 20 08:23:23 EDT 2009 | ratsalad

One diagnostic tool that I have found useful in the past is the "hot plate test". Place suspect components and/or PCB's on a hot plate and turn it on High. Then observe. Granted the conditions on the hot plate are not the same as in a reflow oven,

Baking populated PCBs

Electronics Forum | Tue Aug 25 03:24:11 EDT 2009 | fiona_j

Hello, I have been recently bringing a new RoHS wave soldering machine into production. Unfortunately, I am finding many of the boards are experiencing blow holes. It is always silver plated PCBs and I believe it is related to moisture ingress. I n

SAM vs XRAY

Electronics Forum | Tue Feb 09 23:40:19 EST 2010 | glennster

OK Sergey, looks like no one wants to take this on. I will give it a shot and maybe others will add their 2 cents. The answer depends on what you want to inspect. X-ray inspection is based on the X-ray absorption properties of the materials in th

BGA Placement Process

Electronics Forum | Fri Mar 26 10:35:52 EDT 2010 | grahamcooper22

Hi Krish, thanks for your detailed reply. Sorry I assumed you may be using a solder paste to solder the BGA to the pcb. Either solder paste or Gel flux is best for resoldering BGA to pcb. Are you using Gel flux ? Most popular long term storage for mo

5% color spot in HIC

Electronics Forum | Mon Jul 23 08:35:33 EDT 2012 | grahamcooper22

The lower the RH in the MBB the better for all moisture sensitive devices. Maintaining less then 5% will mean no parts of between 2a-5a MSL will need drying before use. The calculation uses 10% because it is a sensible amount of desiccant to use base

Problems Using Parts From Broker

Electronics Forum | Mon Sep 09 12:00:01 EDT 2013 | proteus

I have a 208 pin QFP that due to manufacture obsolescence I have to get them form the broker market. I've had several issues with the parts including; bent leads, leads that don't take solder very well, co-planarity problems, and DOA fallout after a

High Relative Humidity and Blistering Issues in Assembly

Electronics Forum | Mon Sep 08 21:12:29 EDT 2014 | eurekadrytech

Hello, Manufacturing process with high moisture and humidity environments and long term storage will definitely see pop corning effects once high temperature from soldering and/or re-flow process. The moisture that has been adsorbed is likely the ro

Moisture Sensitive Solutions

Electronics Forum | Wed Oct 01 14:56:56 EDT 2014 | tim_wilkinson

Fuji_user_2014, I work in sales at Manncorp and we have a two styles of dry boxes you may want to consider. We have dry desiccant boxes that will store your components at less than 5% RH. We also have dry baking boxes that will store your componen

Pin Hole Issue after Reflow Soldering - Passive Components

Electronics Forum | Thu Dec 28 16:20:12 EST 2017 | rgduval

Pictures of your issues would help us to help you. Pin holes/blow holes are generally caused by either moisture or flux volatiles/organics. Since you've virtually eliminated moisture, it might be time to look at your paste/flux. You can call eithe

SMD Moisture Sensitive Devices - Baking using vacuum-bake oven - seeking clarification

Electronics Forum | Thu Oct 31 17:24:53 EDT 2019 | slthomas

Sorry I can't really answer any of your questions, but I'm curious about your idea. I've done vacuum drying of implantable medical components (made mostly of a proprietary bio-absorbable composition) but never electronic components. You're right to


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