Electronics Forum: moisture and barrier and bag (Page 1 of 1)

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 15:53:17 EDT 2005 | adrian_nishimoto

This has been a problem with new components coming directly from vacuum sealed desiccant packed moisture barrier bags with moisture level cards. We have also baked all boards prior to the BGA rework to ensure no moisture issues were addressed.

Desiccants and pcb finish degradation?

Electronics Forum | Mon May 21 17:32:23 EDT 2001 | davef

I said: "Our electronic circuit board fabricators seal the boards in moisture barrier bags [MBB]. We discontinued the use of desiccant bags in these MBB because of concerns about the desiccant releasing materials that would affect the solderability

OSP PCB Shelf life and part packs

Electronics Forum | Wed Sep 26 10:05:41 EDT 2012 | testbloke

Although we do not have any soldering issues with our OSP PCB's, I am trying to establish clear rules with regards pcb storage and shelf life. Our PCB's are supplied in metalised moisture barrier bags but without desicant, our current rules as follow

Desiccants and pcb finish degradation?

Electronics Forum | Tue May 15 21:57:06 EDT 2001 | davef

Welcome!!! Where the hay ya been??? Sorry bud, were lining-up with your fab [it hurts me to say that, but when yer  ] We used to dry pack with desiccants, also. Its probably an old MIL-STD-2073-1C requirement [er something like that]. We qui

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Mon Feb 01 10:06:51 EST 1999 | Chris Fontaine

All of our moisture sensitive components are shipped to us in vacuum sealed, desiccated bags with a moisture indicator. When the parts are removed from the bag (this is done at either SMT setup, or in the stockroom) the indicator is checked. If it

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