Electronics Forum: molded interconnect device (Page 1 of 4)

MID ( Molded Interconnect Device ) Mount

Electronics Forum | Sun Nov 24 22:09:13 EST 2019 | fadzril

Does anyone have experience of mounting MID ( molded interconnect device )? What items are required to be prepared? Can I use my current printer, mounter or reflow ovens?

Re: Micro BGA Sockets...

Electronics Forum | Fri Sep 18 07:16:18 EDT 1998 | Wayne Bracy

Steve: You might want to contact Advanced Interconnects I know they manufacture standard BGA fixtures, but not sure about micro BGA. Advanced Interconnects, Inc. West Warwick, RI (401) 823-5200 (401) 823-8723 Fax Howard Gonzales You could also call T

Dye and Pry on PoPs?

Electronics Forum | Mon Aug 15 18:42:53 EDT 2011 | bandjwet

Does anyone have experience in doing dye and pry analysis on PoPs? A customer wants to know whether or not the board level or device-device interconnect is the suspect. What other technique can anyone recommend? BWET

BGA Device with Slanted and Damaged Spheres

Electronics Forum | Mon Dec 20 14:44:30 EST 2004 | JohnS

I had identical issue with CBGA's. I also found stress fractures at the sphere/substrate interconnect. The supplier had data to support their acceptability but we persisted and they reworked them,

MID assembly

Electronics Forum | Tue Dec 16 06:59:47 EST 2008 | janz

Hello, I am looking for technical papers (tips, tricks. machines, materials etc) for MID assembly (Moulded Interconnect Device - 3D assembly). Regards Janz

3D - MID - automatic inspection

Electronics Forum | Fri May 27 07:14:21 EDT 2011 | janz

Hello, I am looking for companies which supply AOI for 3D - MID substrates. (MID- moulded interconnect devices). Regards Janz

Removing Markings from Devices

Electronics Forum | Thu May 01 18:17:09 EDT 2008 | jmelson

I just got done analyzing an old piece of gear with relabeled parts. We had a schematic of the boards, with no info other than the OEM's part numbers and the way the chips were interconnected. It took me no more than 15 minutes with a couple databo

Re: Classification of moisture sensitive devices

Electronics Forum | Sat Aug 28 08:41:12 EDT 1999 | Tom Tellinghuisen

Wolfgang, We also tried to find generic 'guidelines' for Moisture Sensitivity levels. It would be a perfect world, if you could say that all PLCC84's were level 4 devices. Unfortunately it is not that easy. Moisture sensitivity levels are

How to reduce solder joint voids of LED without using vacuum reflow?

Electronics Forum | Tue May 28 18:31:08 EDT 2019 | jlawson

Solder paste flux is main contributor, Lead termination chemical-oxide by products and PCB Plating-Chemicals. Reflow profile would have very limited if not no impact really unless is way off. Paste volume control and Stencil design plays a big part

Hair Line Solder Short at PTH Connector

Electronics Forum | Sat Apr 16 13:43:53 EDT 2005 | KEN

What about electo migration? I had (what apears to be) the exact same problem you describe. X-ray and ICT fails to detect micro shorts. However, in our test, the bench functional test would show a current overload. In some cases the electro migrti

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molded interconnect device searches for Companies, Equipment, Machines, Suppliers & Information

Clariant Cargo & Device Protection
Clariant Cargo & Device Protection

Clariant Cargo & Device Protection offers a complete portfolio of desiccants and humidity indicator cards for use in dry packing.

Other / Manufacturer

101 Christine Drive
Belen, NM United Arab Emirates

Phone: 5059751591