Electronics Forum | Fri Jun 03 15:19:32 EDT 2022 | dwl
I don't recall thicknesses off the top of my head but brittleness becomes an issue more for gold plating then ENIG. .125 um should be fine. also, gold ain't cheap so its unlikely your PCB fab will get anywhere near the max tolerance. On the other e
Electronics Forum | Wed Jun 08 23:04:26 EDT 2022 | SMTA-64387544
Au thickness of 0.125 um should not cause solder joint embrittlement. Also, PCB fab should offer Au thickness range between 0.05-0.075 um for better process control and reliability. Higher Au thickness may suggest black pads leading to solder joints
Electronics Forum | Mon Jun 12 07:42:56 EDT 2006 | brian.perry@suntroncorp.com
We are placing a gold plated device (LCC) to a NiAu PCB using a SnPb No-clean solder. We're noticing quite a bit of difficulty with reliable joints (intermittent connectivity) and if we have to rework a particular device, adjacent devices of this sa
Electronics Forum | Mon Dec 06 03:54:57 EST 1999 | Chris May
Hi Russ, I have a similar situation. I have been told that this can be caused by the nickel, over which the gold is plated, can result in suspect joints, embrittlement etc. Some joints can even be weak and broken without much force on some of my boa
Electronics Forum | Wed Jan 09 14:52:53 EST 2002 | Chris
Hi, I have read many articles about theromsonically bonding to soft gold. Many of these articles state you can bond to 10uinches of gold. I have worked with both Hughes and Panasonic bonders at two different companies and I have never been able to
Electronics Forum | Thu Apr 22 08:43:25 EDT 1999 | Michael N.
| | I'm having problems with trying to get a good solder joint using a Ceramic PCB. We are using AMTECH hi-temp solder (ws-486 96.5/3.5ag). My profile looks great and I used the recommended profile from Amtech with a few adjustments. My max temp is a
Electronics Forum | Fri Apr 29 14:16:16 EDT 2011 | ppcbs
Below is the long explanation. This defect is most commonly found with BGA components, but can arrise with all components. I see it happening more now with lead free boards that are being assembled with a no clean flux. Best short term remedy is t
Electronics Forum | Tue Nov 28 21:07:44 EST 2000 | Alvin K
Gold is porous and spots on gold plated PCBs is one of the drawbacks of using gold as a solderability protector. Base Nickel exposure seems to be the cause of this and is aggravated when the gold thickness is less than what it should be. I agree with
Electronics Forum | Tue Mar 15 22:04:56 EST 2005 | KEN
The hasl joint looks fuller (and is easier to inspect)because it has more solder volume. Think about it. Your pre-plating your board with solder (before you add more solder). I doubt your getting 0.3 mils of hasl.....probably more like 1.3 to 3.0
Electronics Forum | Tue Aug 11 07:51:57 EDT 1998 | Earl Moon
| | | | Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, n
Products, services, training, and consulting for the assembly, rework & repair of electronic assemblies. BGA process experts. Manufacturers Rep & Sole Agent in North America for Shuttle Star BGA Rework Stations.
Training Provider / Manufacturer's Representative / Equipment Dealer / Broker / Auctions / Consultant / Service Provider
1750 Mitchell Ave.
Oroville, CA United Arab Emirates
Phone: (888) 406-2830
