Electronics Forum | Wed May 03 20:24:22 EDT 2000 | Dave F
MF: I know of nothing that addresses your question directly. Let me suggest: * Technical types at your solder supplier should be able to help. * "Effect Of Intermetallic Compounds On The Thermal Fatigue Of Surface Mount Solder Joints" PL Tu, et a
Electronics Forum | Tue Jun 11 14:58:45 EDT 2002 | Chris Lampron
Hello Sean, We are currently using a Pin in Paste process to mount some through hole relays. This particular board has 72 relays per. We have cut the stencil to overprint the hole. By putting a small amount of solder in the hole to flux the lead, th
Electronics Forum | Fri Mar 17 16:39:33 EST 2000 | Larry
We have just installed an omega wave to our W/S machine and are tring to W/S some of our bottom side surface mount components. I am still getting skips on some sot 23's. The component lay out meets all IPC 782 guidelines. I have verified these setti
Electronics Forum | Mon Feb 19 18:57:49 EST 2001 | davef
Expanding on the limit of the portion of gold acceptable in a solder connection [mentioned in an earlier post]: The embrittlement culprit, AuSn4, is 29 weight percent gold. So even if one had 100% tin as the solder alloy and 10% gold were dissolved
Electronics Forum | Tue Feb 27 03:35:23 EST 2001 | peterbarton
Steve, I have to support the comments made by Dave F. Provided the surface mount parts on the second side are correctly orientated and not too close to any adjacent through hole leads then the best option has to be to print glue then wave solder. T
Electronics Forum | Wed Feb 28 03:57:46 EST 2001 | peterbarton
Are you using a water based flux? Are the solder balls mainly around or near non-plated holes or near the edges of the PCB? If so the preheat must be set so the water content of the flux is fully evaporated before the board hits the solder wave. If
Electronics Forum | Mon Mar 19 08:56:17 EST 2001 | fmonette
One very important consideration in your situation is to determine if you have moisture sensitive components on these boards. If you have any device classified level 3 or higher then you have a very high level of risk associated with moisture sensit
Electronics Forum | Thu Mar 29 15:50:35 EST 2001 | tomgervascio
We've think that with seen solder shorts under BGAs after wave soldering the boards. In addition, it seems to be related to a certain soldermask configuration over the topside BGA vias.. THere is one vendor,A, that is applying soldermask after HASL,
Electronics Forum | Sat Apr 14 00:04:21 EDT 2001 | zam_bri
I'm not a Wave soldering guy and my friend have asked me a question on what is the best preheat time and temperature for Wave soldering.They experiences only 10% flow up thru the PTH barrel. I've asked them to increase the temperatue to 120 Deg C. Cu
Electronics Forum | Thu Jul 20 14:52:05 EDT 2000 | Bob Willis
If you are talking about Pin In Hole Reflow that is not true, I hope it was not my friends at Speedline that told you that. Stencil printing of paste for through hole reflow can be done. If you get all the parameters right it can give you joints lik
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