Electronics Forum | Tue Mar 09 18:21:37 EST 1999 | Stan Levitsky
We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce br
Electronics Forum | Wed Mar 10 13:53:13 EST 1999 | Vincent Vega
| We will wave solder a board with SOIC14 and SOIC16 parts on the bottom. It has been difficult to find any specific wave solder process recommendations from manufacturers of the SOICs. The pad geometry utilizes theiving pads on both sides to reduce
Electronics Forum | Wed Aug 12 16:41:20 EDT 2009 | JWPlainview
Thanks for clearing that up, Dave. We've been getting a lot of inquiries citing both certifications. Just thought there might be a link between the two.
Electronics Forum | Mon Nov 27 16:31:07 EST 2000 | Chris Jackson
I am evaluating several pieces of Siemens equipment and would like to get some input from industry users. I am seeing that Siemens is able to meet cycle time estimates and thus throughput. I am concerned about the robustness?? Any input is welcome. T
Electronics Forum | Tue Nov 28 16:28:14 EST 2000 | CAL
Chris- The machines you identified are stable products and have been around for over two years now and most bugs have been worked out. The F5 IC head has not changed much since its introduction over 5 years ago. Remember these machine like to run, r
Electronics Forum | Wed Jun 28 16:16:09 EDT 2006 | Gman
Good article. Would EDX analysis of the cross-section at the void joints be a good method to determine any plating contamination or solder mask issues?
Electronics Forum | Wed Sep 25 06:56:16 EDT 2002 | CH
U may check your profile ramp rate. The flux may evporated and look like cold joint
Electronics Forum | Fri Oct 14 16:26:40 EDT 2005 | Lapo
Vb software , try another one !
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