Electronics Forum | Fri Dec 01 12:40:04 EST 2000 | Dason C
I agreed with PeteC to use the selective wave pallet, please aware TSSOP is classify as MSL 3. The advantage of the surface mounting allow both package body size and thickness to decrease but also increase the density of the package. Direct heating
Electronics Forum | Fri Jan 04 15:34:49 EST 2002 | fmonette
As Dave mentioned we have put together a MSD audit checklist to insure that your internal procedure is complete and in line with J-STD-033. It's a free download at http://www.cogiscan.com, click on Moisture Sensitive Devices to access the MSD Knowle
Electronics Forum | Wed Jan 16 20:06:09 EST 2002 | davef
No, not as such. Consider: * Using the IPC calculator [free at http://www.ipc.org]. It allows you to consider / assess the amount of solder when designing pads. * Reviewing IPC-7525 - Stencil Design Guidelines. It gives general aperture guidelines.
Electronics Forum | Fri May 09 09:09:22 EDT 2003 | fmonette
Phil, here is why "dry cabinet storage may not stop the clock" : The moisture diffusion inside a component is actually quite complex. When previously exposed components are returned to dry storage, the moisture gradient that is already absorbed in
Electronics Forum | Thu Mar 17 10:24:43 EST 2005 | Bob R.
I can't answer your question directly, but we're an automotive supplier and we don't do dual reflow with QFPs because of their moisture sensitivity level. We don't have the processes in place to manage the time between first and second pass so we'd
Electronics Forum | Thu Dec 22 04:34:47 EST 2005 | rlackey
11,000 parts? Easy life. We have 66,000 lines in stock & about 500,000 on the system. We've added extra fields on the database for every part number with ROHS status, MSL, PBT, & end termination info added. We've also had to create duplicate part
Electronics Forum | Fri Feb 03 09:44:26 EST 2006 | amol_kane
Hi James, As far as i can see, if you reseal the bags, then storing in a dry cabinet would be unuseful (as the McDry will no longer be able to absorb moisture from the components, and the dry bag will only be as effective as the desiccant in it) i t
Electronics Forum | Mon Jul 10 09:23:47 EDT 2006 | Rob
Hi Dougs, Info as follows: TAICOM TSD42: Matte Tin, 240C for 5 secs TAICOM TSD08: Matte Tin, 225/3 secs (I wouldn't!) TAICOM TKB06MSL: Matte Tin 260/40 secs (TBC) HARTING 09232486824: Harting don't supply. TAICOM TI40BHS: Matte Tin, 225/3 secs (I
Electronics Forum | Mon Nov 20 09:44:07 EST 2006 | Amol Kane
you can reference JESD97 for labeling LF components, also. i have sent a similar letter to our suppliers and am fielding questions ranging from, what is a MBB to why such strict packaging requirements. i was surprised to know that the requirements
Electronics Forum | Mon Nov 20 11:58:16 EST 2006 | Rob
We try and do it all (Vac pack, dessicant, indicator card, MSL level, PBT, end termination material etc.) however it throws a spanner in the works if you pull a manufacturer's sealed pack from stock and the vacuum has gone where an edge of a tray has
