Electronics Forum: msl-1 and level (Page 1 of 14)

Ag-plated LED dipping - high level of Cu and Ag

Electronics Forum | Tue Aug 14 23:58:19 EDT 2001 | Glen Brian

We are using the new auto-dipping machine for LED solder dipping and dragging. The flux is water-soluble flux and the solder is 63/37 at 250 deg. C. Two weeks ago we exchanged the pot with new 63/37 solder. About a week, we found that the high level

Ag-plated LED dipping - high level of Cu and Ag

Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef

First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so

Buying stenciling and pick and place equipement.

Electronics Forum | Fri Dec 17 18:21:43 EST 1999 | Clarissa L. Ortner

We are a small start up. We will be buying a stenciling machine and semi automated pick and place. ( We have the oven) We are presently stenciling without any assit and loading leadless parts only(no fine pitch) by hand. We need to improve thrupu

GSM2 and FlexJet heads

Electronics Forum | Thu Mar 18 18:52:29 EDT 2010 | edwaterfall01

There is a retrofit kit to take care of the head cable problem that you mention. The s/n with 7P in it represents what is called the 7 Plus level of the head. There was one more level after that (09) for the GSM. The better heads mentioned in the

No Clean and Underfill

Electronics Forum | Wed Mar 04 22:57:05 EST 2009 | davef

Underfill epoxies may be classified into major groups [Capillary Underfill Manufacturing Development and Characterization for 2nd Level Electronic Interconnect Processes; B Salom�n; University of Puerto Rico, Mayaguez Campus; Dec 2004]: * Capillary.

SPC, PPM and DPMO

Electronics Forum | Fri May 23 03:39:06 EDT 2003 | mantis

Hi Chris, I found this site to be very useful and explanitory while calculating the sigma level of or company. http://www.isixsigma.com/sixsigma/six_sigma.asp It has explanations on anything and everything process control related. Regards,

Tp9 and Tp9 ufp

Electronics Forum | Tue Oct 25 15:03:48 EDT 2011 | sjs2303

Hi Bert, For your second issue, are the tools well lubricated? If not the Midas head can fail to grab the tool and can generate the z motor error. Doing this followed by a base-centre level measurement should resolve your problem. Steve

Altitude and solder voids

Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128

Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post

Manncorp Pick and Place

Electronics Forum | Thu Jul 31 13:44:07 EDT 2014 | budro

Does anyone have experience with Manncorp equipment? I’m evaluating equipment to install a mid-level production line, and Manncorp was suggested to me to consider. Other equipment I’m considering are Essemtec and Mydata. Any input would be appreciat

Mydata Pick and place

Electronics Forum | Wed May 09 10:39:03 EDT 2001 | davef

The two first level cuts at comparing placement machines are: * Placement rate * Range of component capabilities This boils-down approximately to machine price. Virtually, everyone's feeders are priced similarly. Go to "Circuits Assembly" magazine

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