Electronics Forum: msl-3 and level (Page 1 of 14)

Ag-plated LED dipping - high level of Cu and Ag

Electronics Forum | Tue Aug 14 23:58:19 EDT 2001 | Glen Brian

We are using the new auto-dipping machine for LED solder dipping and dragging. The flux is water-soluble flux and the solder is 63/37 at 250 deg. C. Two weeks ago we exchanged the pot with new 63/37 solder. About a week, we found that the high level

Ag-plated LED dipping - high level of Cu and Ag

Electronics Forum | Wed Aug 15 16:04:23 EDT 2001 | davef

First, responding to your question � Several things on copper dissolution in solder are: * A 50um copper wire will dissolve in 60Sn / 40Pb solder at: - 200�C solder in 55 seconds; - 250�C solder in 20 seconds; - 300�C solder in 5 seconds; - 350�C so

Mix Pb and Pb free alloy

Electronics Forum | Thu May 25 11:31:52 EDT 2006 | muse95

Patrick, I believe you are mistaken about this being a myth. Many component manufacturers changed more than plating to make their component withstand higher temps. Some changed mold compounds, others changed plastic types used. Many of these change

Buying stenciling and pick and place equipement.

Electronics Forum | Fri Dec 17 18:21:43 EST 1999 | Clarissa L. Ortner

We are a small start up. We will be buying a stenciling machine and semi automated pick and place. ( We have the oven) We are presently stenciling without any assit and loading leadless parts only(no fine pitch) by hand. We need to improve thrupu

GSM2 and FlexJet heads

Electronics Forum | Thu Mar 18 18:52:29 EDT 2010 | edwaterfall01

There is a retrofit kit to take care of the head cable problem that you mention. The s/n with 7P in it represents what is called the 7 Plus level of the head. There was one more level after that (09) for the GSM. The better heads mentioned in the

No Clean and Underfill

Electronics Forum | Wed Mar 04 22:57:05 EST 2009 | davef

Underfill epoxies may be classified into major groups [Capillary Underfill Manufacturing Development and Characterization for 2nd Level Electronic Interconnect Processes; B Salom�n; University of Puerto Rico, Mayaguez Campus; Dec 2004]: * Capillary.

SPC, PPM and DPMO

Electronics Forum | Fri May 23 03:39:06 EDT 2003 | mantis

Hi Chris, I found this site to be very useful and explanitory while calculating the sigma level of or company. http://www.isixsigma.com/sixsigma/six_sigma.asp It has explanations on anything and everything process control related. Regards,

Tp9 and Tp9 ufp

Electronics Forum | Tue Oct 25 15:03:48 EDT 2011 | sjs2303

Hi Bert, For your second issue, are the tools well lubricated? If not the Midas head can fail to grab the tool and can generate the z motor error. Doing this followed by a base-centre level measurement should resolve your problem. Steve

Altitude and solder voids

Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128

Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post

Manncorp Pick and Place

Electronics Forum | Thu Jul 31 13:44:07 EDT 2014 | budro

Does anyone have experience with Manncorp equipment? I’m evaluating equipment to install a mid-level production line, and Manncorp was suggested to me to consider. Other equipment I’m considering are Essemtec and Mydata. Any input would be appreciat

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