Electronics Forum | Mon Dec 13 14:13:39 EST 2004 | Gary
We are setting up our criteria for acceptance of solder voids. We would like 2% to 4% or smaller as our tolerance. Does this sound reasonable? Are most x-ray machines able to accurately measure at that size? Also, do most people find that 2% to 4
Electronics Forum | Mon Dec 13 14:41:41 EST 2004 | DasonC
Check IPC-7095, 18.104.22.168 For Class 2, 45% of the diameter adn 20.25% for the area.
Electronics Forum | Sun Dec 17 22:55:45 EST 2006 | foolat
I'd like to know how much capacitor offset from the pad should be acceptable? What are the risks of the placement offset if greater than the acceptable level? I'm still quite new to this so any help will be very much appreciated. Thanks
Electronics Forum | Tue Oct 17 10:42:44 EDT 2006 | chrisgriffin
Definitely too much pressure for any fluxer I've seen. Something must be restricting the flow. Maybe the nozzle.
Electronics Forum | Sun Nov 26 08:21:41 EST 2006 | callckq
Dear All, Is anyone know why too much solder paste might cause tombstoning defect? Thanks
Electronics Forum | Tue Jul 01 15:54:54 EDT 2008 | short_timer
I believe you hit the nail on the head. I just needed to hear it from another person. Glue is a good option. I'll give that a try.
Electronics Forum | Tue Jul 01 22:26:05 EDT 2008 | davef
Why do you want to increase the strength of the solder connection? Our experience shows that a proper solder connection has more strength than the strength of the pad to the laminate.
Electronics Forum | Wed Jul 02 08:06:10 EDT 2008 | ck_the_flip
Yes, your strength of the joint is in the intermetallic, and not additional solder. Solder ain't like duct tape, where the more you put, the better it'll hold.
Electronics Forum | Sun Dec 17 23:51:51 EST 2006 | foolat
what about for cases of 0306 and 0204 chip capacitors? what is end overhang?
Electronics Forum | Sun Dec 17 23:53:08 EST 2006 | foolat
oh and i forgot, what's the risk/failures to the pcb board/unit if these specs are not followed?