Electronics Forum: much (Page 361 of 627)

Wavesoldering

Electronics Forum | Thu Mar 15 17:19:12 EST 2001 | mparker

Are the tin/lead ratios compatible betweem HASL and wave solder? Probably are, just a remote possibility. Flux application is? bubbler, sprayer? Either way, are you getting good misting, coverage on those teeny 0.5mm test points? If not, then no

Need Expert Support

Electronics Forum | Tue Mar 13 14:17:00 EST 2001 | blair

Thanks a lot for the response 1) there are 8 BGA on this board 6 PBGA, 1 TBGA and 1 ESBGA (metal lid). They are dispersed over the board (approx 11"* 14") 2) Is there a tool to use to understand pitch/bump size and stencil aperture (optimized)? 3) Y

Need Expert Support

Electronics Forum | Tue Mar 13 17:26:07 EST 2001 | blair

1) We could press on BGAs and the boards would boot 2) This is basic boot up yield 3) We are now getting stpe by step inspection data going fwd. 4) So, Stencil design could be a critical factor. Any documented guidelines? 5) Yes DFX was done - mostl

Ready, Shoot, Aim!!!!

Electronics Forum | Mon Mar 19 21:25:13 EST 2001 | davef

The technique you describe is contrary to the approach we've taken to educating our folk and helping all to understand what's going on and being involved. Not sure how well that would play in Peroria. I'm looking for tools / techniques / what not t

Upside Down Chips

Electronics Forum | Thu Mar 15 03:24:48 EST 2001 | Scott B

We are currently having a conflict of opinion with our QA department regarding the very few occurences we have of chip resistors being soldered upside down (i.e. the resistive element towards the board). IPC-A-610C para 12.3.2 specifies that this co

Gold Contacts

Electronics Forum | Fri Mar 23 11:58:01 EST 2001 | mparker

You are mixing long exposed paste back into fresh? How long has your fresh jar been open to the air? You are probably doing yourself a disservice by scavenging the paste (it could have moisture entrapped). Your visocity has definitely changed. You a

Gold Contacts

Electronics Forum | Sat Mar 24 00:50:24 EST 2001 | PeteC

Fresh paste from a factory sealed container. Should paste be scrapped out altogether if left on the stencil for too long (length-of-time?)? Our paste is Multicore CR39. Multicore reccomended the print chamber be around 22C @ 50%-60% RH. Our plant is

No-clean solder paste

Electronics Forum | Thu Mar 22 17:37:06 EST 2001 | davef

Hey!!! Watch it!!! I don�t want to get you believing too much of this stuff. But if you bought that, listen to this � some circuits are so critical with that skin effect stuff that they use silver as the top level solderability preservative. Turn

Insufficient Heel Fillets on plastic 240 pin QFPs

Electronics Forum | Thu Mar 22 21:10:42 EST 2001 | dblsixes

Ah ha! ... You hit upon something that I discovered earlier today ... As I said in an earlier post, I was going to experiment with dog-boning the solder paste ... But upon further review, I discovered that our customer removed 75% of the pad behind t

How to test & measure capacitors/resistors shear force strength

Electronics Forum | Fri Mar 30 13:06:50 EST 2001 | aortiz

Hi, I need support on the method or applicable standard to measure the shear force strength on chip capacitors and resistors. I know the soldered joints strength is related to land desing, solder volume, pcb and component solderability, component


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