Electronics Forum | Wed Feb 10 07:01:49 EST 1999 | Joe
We use both F4G and MCS at the present and we are phasing out MCS. One main reason is that it's platform is not Y2K compliant. F4G is cumbersome and taxes a high overhead on your computer system. We have also found a bug recently when we have high
Electronics Forum | Tue Feb 09 10:16:15 EST 1999 | Jim Gleason
Earl, We have found that many people get closer to a zero defect program using pallets. Since you eliminate manula masking you eliminate on huge area of possible defects production. Since the pallets can align connectors etc, you get less defects due
Electronics Forum | Wed Feb 03 16:38:19 EST 1999 | Steve Gregory
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
Electronics Forum | Wed Feb 03 18:32:07 EST 1999 | Earl Moon
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
Electronics Forum | Wed Feb 03 22:37:50 EST 1999 | Dave F
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
Electronics Forum | Thu Feb 04 10:00:26 EST 1999 | Terry Burnette
| I'd like to find some technical papers on the reliability of reworked BGAs. If you know of any, please let me know. | | I have a concern about this because our current rework process does not apply solder paste to the pads prior to placing the pa
Electronics Forum | Thu Feb 04 15:44:04 EST 1999 | Michael Allen
Actually, solder paste adds about 12% to the joint volume for PBGAs, or about 31% for MicroBGAs -- assuming standard (recommended) pad sizes and stencil thicknesses, and paste with 90% metal content (50% metal by volume). | | I'd like to find some t
Electronics Forum | Fri Feb 05 12:50:06 EST 1999 | Steve Gregory
| Love the picture. | | We are considering the PRC 1500. It combines a thermoflo unit with a MBT 250A which we currently use. Does anyone know the difference between the TF200 and the TF700? This is the first I have seen the TF700 mentioned. | |
Electronics Forum | Mon Jan 25 20:53:03 EST 1999 | Earl Moon
| Greetings, | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | Also, is there any danger of the pcb's giving off some kind of gas or vapour which can b
Electronics Forum | Tue Jan 26 19:30:36 EST 1999 | Nik
| | Greetings, | | | | Can anyone tell me what temperatures pcb's should have when coming out of a forced convection reflow oven and out of a wavesoldering machine. | | Also, is there any danger of the pcb's giving off some kind of gas or vapour whi
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