Electronics Forum | Mon Jul 26 14:14:51 EDT 1999 | Steve Gregory
| | | We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | | | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is th
Electronics Forum | Mon Jul 26 19:18:07 EDT 1999 | Boca
| I'm interested in hearing how many forum fans are interested in blatant advertising in the forum pages. At least Mike listed everyone instead of tooting his own horn. Some vendors support sites like these by buying banners and such. How effectiv
Electronics Forum | Mon Jul 26 20:07:55 EDT 1999 | Rob Fischer
| | I'm interested in hearing how many forum fans are interested in blatant advertising in the forum pages. At least Mike listed everyone instead of tooting his own horn. Some vendors support sites like these by buying banners and such. How effect
Electronics Forum | Wed Jul 14 11:36:56 EDT 1999 | Jimmy Strain
| | | Hi All, | | | Does any one experienced the solder on gold finger after | | | reflow. Its about 5 to 8 mils diameter . | | | We'd clean the entire screen printer, mounter & reflow as well, | | | but doesn't help much. | | | | | | | | Mr Kong..
Electronics Forum | Fri Jul 16 14:05:04 EDT 1999 | Jim Blankenhorn
| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t
Electronics Forum | Fri Jul 02 05:28:13 EDT 1999 | Vinesh gandhi
| | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design).
Electronics Forum | Fri Jul 02 09:54:02 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
Electronics Forum | Fri Jul 02 10:06:17 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
Electronics Forum | Mon Jun 28 22:02:13 EDT 1999 | Dave F
| Hey there gang, how's it going ? | | Anyway's here's my probelm, got a new product to build double sided reflow, lot's of so20's and PLcc's 1206's, 0805's the usual stuff. Probelm is all the pad spacing of the 1206's are too big, my component's ar
Electronics Forum | Wed Jun 30 06:28:12 EDT 1999 | Earl Moon
| | snip | | | John and Dave, | | | | Again, I don't work with larger chip devices with this issue. The company I now work with developed a strategy, based on considerable research (as others of us did in the past), to do things like placing 0603'
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