Electronics Forum: multiple modules (Page 1 of 2)

Grid-Lok Leaking

Electronics Forum | Thu Sep 15 11:18:04 EDT 2016 | cyber_wolf

When you attach multiple modules to the manifold, this is the only one that screws up ? It sounds like something maybe hooked up backwards.


Electronics Forum | Sun Sep 16 18:57:29 EDT 2018 | spoiltforchoice

Visit the machines, get your quotes. Establish what you need, make sure you understand the running costs of each, the availability of service personnel & parts - see who wins. The answer won't be the same for everyone. Also see which software you lik

Inventory control of SMT parts

Electronics Forum | Fri May 17 11:00:57 EDT 2002 | Sam Chiocca

Demand Wave Solutions has an inventory control module, BOSSgoldIC, that can be integrated with your present ERP system or implemented individually on an open architecture platform. It is on-line, interactive inventory management system that provides

Specifying Surface finish on a BGA Module

Electronics Forum | Wed Apr 30 21:00:36 EDT 2003 | davef

ENIG is a common solderability protection on BGA packages. Pd/Ni/Au while more expensive could have advantages over ENIG in the following area: * Allow both gold and aluminium wire bonding * Better solder resist compatibility (63�C max) * Might take

Universal Genesis Inline7

Electronics Forum | Tue Nov 20 11:19:07 EST 2018 | spoiltforchoice

Ahh but you're missing the key points. The YSM40 is in no way ever intended to operate on its own, to keep those 4 heads busy they all need to be placing high volume parts, combined with a high throughput of PCB's probably in dual lane mode which in

Heller 1809EXL TDM repair

Electronics Forum | Tue Jun 23 22:19:33 EDT 2020 | kumarb

Hi. Have an older 1809EXL that was purchased new and has sat idle for years with 270 on hours as of today. After days of testing, unable to melt fresh paste from Loctite (SAC305). The root cause after the investigation is due to one of the 2 TDM modu

CIM systems and Final Assembly

Electronics Forum | Mon Jan 22 15:01:32 EST 2001 | aiscorp

CIM systems for electronics assembly have traditionally considered the PCB only. Final assembly "modules" are often attached to traditional systems to accommodate this common requirement for pre-PCB assembly, mechanical assembly, and final assembly

Adding new line

Electronics Forum | Wed Mar 20 09:59:10 EDT 2013 | mainenetservices

Regarding the software part of this thread, one of our long time forum supporters has a product that also may be helpful - Rich Larue from Unisoft says, "It looks like ANTON99 is looking for is a BOM comparison across multiple assemblies to ID like

How many times can a component go through reflow oven?

Electronics Forum | Tue Aug 18 17:49:16 EDT 2009 | dyoungquist

Is there a limit to how many times a pcb with components can be run through a reflow oven before the components start to degrade? Example: We load the SMT components on the bottom side of the pcb and run it through the reflow oven. Next we load the

10 Methods for PCB Heat Dissipation

Electronics Forum | Mon Oct 26 02:00:36 EDT 2020 | chucherry5076

https://www.jrpanel.com/R The heat generated by electronic equipment causes the internal temperature to rise rapidly. If the heat is not dissipated in time, the equipment will continue to heat up and the components will overheat and fail, resulting

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