Electronics Forum: n2 and h and solder (Page 1 of 3)

Soldering robot and solder balls

Electronics Forum | Mon Jun 26 08:57:17 EDT 2017 | capse

If N2 is not an option, the cut wire feeder or drilled wire are your best bet for now. You need to optimize wire feed rate as well. The solder joint on the robot takes about the same time to form as in manual soldering. If you need to speed the solde

Soldering robot and solder balls

Electronics Forum | Thu Jun 22 15:05:55 EDT 2017 | solderingpro

There are several different technologies in the industry today to assist in the out-gassing of flux cores. On automated soldering systems, there are two main types of perforating solder feeders: - Hole Drilling - "V" Scoring By perforating the so

N2 and Voiding??

Electronics Forum | Thu Oct 18 11:08:22 EDT 2012 | scottp

Since we follow IPC Class III, I've done experiments turning N2 on and off and measuring void level with both SnPb and SAC305 solder. In both cases there was a statistically significant, measurable increase in voids with N2, but it wasn't significan

OSP and SIR

Electronics Forum | Wed Aug 21 17:44:32 EDT 2002 | davef

Splitting hairs, I expect SIR of all solderability protection, including OSP, to decrease after reflow. What�s more, I expect the SIR of all solderability protection to pretty much decrease over time. The �comb pattern� test specimens meet requirem

Solder Paste Storage and Control

Electronics Forum | Thu Oct 30 11:34:51 EDT 2008 | davem

Guys, So I recently started working for a small CM in Southern N.H. We currently use 2 Magic Chef Mini wine friges to store the solder paste (63/37, RoHS). I've been monitoring the room temp (and humidity) and the frige temps all this week. The pro

Nitrogen gas and Tombstone defect

Electronics Forum | Tue Nov 29 14:55:17 EST 2011 | jlawson

N2 is a reflow process widener so to speak, for leaded reflow less of a impact, for LF more impact, and if using finer LF solder pastes T4,T5 and smaller paste deposits generally, it helps widen window for flux in paste in oxide protection during soa

Ecofree 303 conductive and corrosive?

Electronics Forum | Mon Aug 24 07:32:34 EDT 2009 | hurr

Hi Joane, this flux is primarily designed for wave soldering. I think that manual soldering it´s possible. Certainly it´s very hard to dispensing correct amount of the flux. Succinic acid is one from all ingredients of this flux. If you have this

CSP and BGA soldering difference.

Electronics Forum | Mon Apr 02 01:24:52 EDT 2007 | Haris

Dear all, I want to know the difference between the CSP and the BGA (I think there is only in the mesh pin difference). Secondly, if their solder balls have same dia, LxBxH are also same with the the manufacturing of the pin coating chemical elemen

Indium No-clean and Inert Reflow oven (N2)

Electronics Forum | Wed Jul 31 14:08:22 EDT 2002 | Dave G

Used this paste on ENIG boards W/O N2 and had very good results. (0402's,BGA's,16mil FP) Never had the need to use N2 with this paste on our products. Running with N2 shouldn't hurt anything. The wetting properties should get even better than they ar

Heat guns and component damage

Electronics Forum | Tue Jan 31 15:40:44 EST 2006 | mgdrouin1

Comp is relay. I've pulled the spec. Max 240. Using Leister h/g with manual temp settings from 1-6 (20 - 600C)set by the operator. Gun was set to setting 4. They are using the heat gun to reflow the solder after SMT but before wave. High fai

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