Electronics Forum: near (Page 1 of 108)

Components near breakouts

Electronics Forum | Tue Dec 01 17:43:35 EST 2015 | barryg

Hi all, I was wondering if there are guidelines for how near components are to breakouts, and orientation of components near breakouts? Does IPC or other address this? We are sometimes approached with some crazy PCB layouts with multiple PCB's per ar

Wirebond issues near SM

Electronics Forum | Mon Nov 30 11:41:05 EST 2009 | sforman1

Ni is coming up through soft Au. Sam forman

Wirebond issues near SM

Electronics Forum | Mon Oct 26 07:37:15 EDT 2009 | mysmt

Hi, Is your problem solved? If yes then how? Have you tried Plazma cleaning before wire bonding? BR

Wirebond issues near SM

Electronics Forum | Mon Nov 02 16:24:01 EST 2009 | cab

Au measured out( using XRF)at 55-75micro-inches. Within spec, per out QA dept.

Components near breakouts

Electronics Forum | Fri Jan 08 07:45:00 EST 2016 | nonford150

My DFM rules are no chips within 250 mils of a breakout and all chips in parallel to the breakout. Made these changes after some nasty line failures years ago. Not one in or out of house failure due to cracked discrete chips since.

Wirebond issues near SM

Electronics Forum | Fri Oct 30 09:19:46 EDT 2009 | cab

We have performed some EDS analysis and found high percent (approx 18% ) of Ni on surface of gold pad. Found Tungsten as well. This is an HTCC alumina package. Thickness of gold was confirmed and found to be in spec. We believe we are dealing wi

Wirebond issues near SM

Electronics Forum | Thu Oct 08 11:33:16 EDT 2009 | cab

We are currently wirebonding MCMs with surface components located in very close proximity to wirebond pads, which are gold plated. We are ball bonding with 99.99% Au wire. Normally we do not have problems, however if product has been reflowed seve

Wirebond issues near SM

Electronics Forum | Thu Oct 29 20:19:43 EDT 2009 | 89jeong

Hi. We are doing Au bonding on Al bond pad not Au plated. If pull strength is less than 2.0g, i think that the ball or stich may be lifted from bond pad. And the value become lower after several reflow. I expect that the surface of bond pad may be c

Wirebond issues near SM

Electronics Forum | Sat Oct 31 01:22:35 EDT 2009 | mysmt

We have performed some EDS analysis and found > high percent (approx 18% ) of Ni on surface of > gold pad. Found Tungsten as well. This is an > HTCC alumina package. Thickness of gold was > confirmed and found to be in spec. We believe > we

PCB manufacturer near Quebec, Canada

Electronics Forum | Thu Sep 01 16:56:21 EDT 2005 | lyrtech

Hi, I need another PCB manufacturer for our EMS division because we have some trouble with our actual supplier. Do anyone know a good place in canada or USA with competitive price and service? Regards,

  1 2 3 4 5 6 7 8 9 10 Next

near searches for Companies, Equipment, Machines, Suppliers & Information