Electronics Forum | Sat Jun 12 16:45:48 EDT 1999 | JohnW
| | | Does anyone out there involved in RF manufacture have any experience with the KIC Slim-Kic profiler? Do you find any interference problems between the RF transmissions and the testing of your products. We build primarily high-freq stuff like po
Electronics Forum | Sat Jun 12 17:41:13 EDT 1999 | JohnW
| | | Does anyone out there involved in RF manufacture have any experience with the KIC Slim-Kic profiler? Do you find any interference problems between the RF transmissions and the testing of your products. We build primarily high-freq stuff like po
Electronics Forum | Tue Jun 15 16:37:17 EDT 1999 | Philip Kazmierowicz
| | | | Does anyone out there involved in RF manufacture have any experience with the KIC Slim-Kic profiler? Do you find any interference problems between the RF transmissions and the testing of your products. We build primarily high-freq stuff like
Electronics Forum | Tue Jun 08 17:52:53 EDT 1999 | Chrys Shea
| | | Hi,my master | | | How to iron out such soldering bridge with below conditions: | | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | | 3.using s
Electronics Forum | Fri Jun 04 15:43:06 EDT 1999 | JohnW
| | Any of you Process/Manufacturing Engineers, techs, etc..or those of you who 'have a clue' about this stuff been victimized by (clueless and uneducated) Manufacturing Supervisors and (clueless and uneducated) Managers who blame EVERYTHING on YOU,
Electronics Forum | Sat Mar 06 08:26:59 EST 1999 | Dave F
| Clarissa, | | We place the parts using two different methods. One is using a Fritsch semi automated pick and place. The other is using a vacuum pen. One of the assemblers said if she just had to choose one, she would pick the vacuum pen. I kn
Electronics Forum | Fri Jan 22 15:48:14 EST 1999 | Chrys
| Hello, | | I will be evaluating and qualifying two equipment types. The first is a fountain soldering device. I need practical advice on all the stuff you guys and gals know about as good, bad, ugly, best applications, setup, limitations, and all
Electronics Forum | Mon Jan 11 18:07:55 EST 1999 | Lech Bartnik
| | | This is a question for those of you who actually assemble components onto a board. | | | Any idea what the "industry standard" is for fall out on assembled PCB's? I realize that the controls put in place in your processes will effect your ove
Electronics Forum | Thu Dec 31 01:09:18 EST 1998 | Kelvin Chow
Dear Micheal, SIR test is used to characterize fluxes by determining the degration of electrical insulation resistance of rigid printed wiring board specimens after exposure to the specified flux. (IPC TM-650 #2.6.3.3 http://www.ipc.org/html/tm2.6.h
Electronics Forum | Thu Dec 31 14:20:35 EST 1998 | Michael Allen
Kelvin, Yes, we're referencing the same spec. I performed the test under the Class 2 conditions (except that I used a 100V bias rather than 50V...but my water-washed microBGAs still passed). Regarding the omegameter test: we have this instrument,
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