Electronics Forum: near (Page 36 of 111)

X outs

Electronics Forum | Tue Jul 30 11:31:37 EDT 2002 | Bob

Be careful when using a sticker, if it is too thick it can affect the print, you may get leakage which can cause the underside of the stencil to get dirty. Another option depending on the quantity is to segregate the boards so that you do not have t

SMT Equipment

Electronics Forum | Mon Jul 29 08:21:54 EDT 2002 | pjc

All DEK 248 semi-auto printers have been built in China for quite some time (years). Its shipped to the UK from China. All DEK ELA models are now built in China (past 6 mos.?). Thats the fact Jack. All MPM models are built in Mass. Its the savings in

The next wave

Electronics Forum | Tue Aug 06 17:14:33 EDT 2002 | melo_guy

I thought this would be a good place to post to get input from the "trenches" as to what is going to be the next consumer fad? It seems like the market is in need of something new to instigate future consumption. I work for an electronic component

X-Ray equipment for BGA inspection

Electronics Forum | Wed Aug 21 17:51:58 EDT 2002 | davef

Our sympathies on: * Working for a CM. Nufsed. * Living in Eastern Canada. Time find the snow shovel, eh? Consider: * Searching the fine SMTnet Archives for a list of used equipment resellers and refurbishers. * Using the SMTnet �Marketplace� [in

BGA void removal

Electronics Forum | Wed Oct 09 20:52:27 EDT 2002 | davef

Russ, Be careful on how you determine your liquidous point. Sure 205-210�C is fine if your paste and the solderability protection on pads and component leads are near eutectic solder and things worked according to plan, but in real life it doesn't

BGA void removal

Electronics Forum | Sat Oct 19 11:48:39 EDT 2002 | davef

Good points, John. Continuing to track on the voiding issue, why remove voids anyhow? * Voids are primarily process indicators. There is experimental evidence that voids retard crack propagation locally around the void on at least on a temporary bas

MELFs

Electronics Forum | Mon Nov 04 16:54:13 EST 2002 | pjc

For me it was the 1.0mm nozzle, if we're talking mini-MELF here. Also, slowing the turret speed helps. Had mine at 30%. Results vary if placing on paste vs. glue. Paste is better. Still, the std. 1.0mm nozzle is where near as good as with the MELF no

Amistar

Electronics Forum | Tue Feb 10 13:58:43 EST 2004 | EHess

Scott, We have 2 Amistar Placepro 5620's and 2 5720's. One with a TF-14. I've personally been working on these for the past 10 years or so. Have a pretty good grasp of the process, if placepro's are what you are using. Glad to see Amistar is

Amistar

Electronics Forum | Wed Feb 11 13:42:11 EST 2004 | fatally_phoenix

Scott, We have 2 Amistar Placepro 5620's > and 2 5720's. One with a TF-14. I've personally > been working on these for the past 10 years or > so. Have a pretty good grasp of the process, if > placepro's are what you are using. Glad to se

Cracked vias

Electronics Forum | Mon Dec 16 10:54:48 EST 2002 | davef

Knee of barrel and pad crack: Caused by thermal stress during soldering, because epoxy expands in the "z" 3X more than "x" or "y" which are restricted by the fiber. Related to: * Design of pads too large relative to hole diameter * Temperature at o


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