Electronics Forum: needle clog solder paste (Page 1 of 10)

High-speed solder paste dispensing. MY500, MY600, FX-D....?

Electronics Forum | Wed Dec 24 12:01:36 EST 2014 | emeto

Hi, I think that the jet printer is going to work for your process - the key with this device is to maintain it really good so you don't get any clogs. These are very fast devices.

High-speed solder paste dispensing. MY500, MY600, FX-D....?

Electronics Forum | Tue Dec 30 20:23:34 EST 2014 | jeff701

What does "maintain it really good" entail? For reference, this is our maintenance procedure for the FX-D: - At the end of an 8hr shift, the solder paste path is purged start-to-finish using Nordson's ValvePurge. The machine's then powered down and

High-speed solder paste dispensing. MY500, MY600, FX-D....?

Electronics Forum | Tue Dec 23 09:13:12 EST 2014 | jeff701

I'm in a manufacturing environment with a very high mix of boards, and some low-mid volume. A "large" production run might consist of 100 boards. Volume: There are numerous boards that have a volume of 1-3 pieces. There are a few boards with an annua

Use of solder paste after taking out from cold storage

Electronics Forum | Thu Oct 27 00:45:41 EDT 2005 | pavel_murtishev

Good morning, I can recommend to use solder paste softeners, which can prepare solder paste for printing process. Softeners rise paste temperature by means of pseudo-planetary motion. Therefore, solder paste reaches room temperature during only 15

Kester paste problems

Electronics Forum | Tue May 22 20:27:34 EDT 2007 | davef

What are the area and aspect ratio of the apertures that clog? When you print, you should be able to fit at least 4 of the mean sized solder sphere across the width or diameter of your smallest apertures.

Solder paste height checking

Electronics Forum | Sat Feb 19 09:26:19 EST 2005 | davef

Your customer asks a reasonable question. How do you know that your: * Paste has not dried? * Stencil aperatures have not become clogged? * On and on ... Some agrue that printing is the most critical process and that it drives all down-stream failu

Kester paste problems

Electronics Forum | Tue May 22 11:03:11 EDT 2007 | Michelle

We now have an AOI in our process after printing and have noticed that all the small aperatures are getting clogged by solder paste. Mainly on all fine pitch parts. We are using Kester ws R562 SN63/PB37 mesh -325+500 90% metal. It was manufactu

Solder paste height checking

Electronics Forum | Wed Mar 02 05:14:07 EST 2005 | ABHI

Guys, Solder paste height worries all of us as we encounter the non wets after reflow. More so in fine pitch QFP's. The non wets are not always caused by solder paste height. Many other contributors. Even the pad geometry on te board can contribute t

Solder paste height checking

Electronics Forum | Mon Feb 21 02:02:54 EST 2005 | JSS

First of all THANKS for thr reply. I totally agree with u that paste dried,stencil aperture clogged like probs comes during the production but we hv a visual inspection stage (with 5X illuminated lamp)after printing process and before inserting the

Solder paste height checking

Electronics Forum | Thu Mar 31 07:56:31 EST 2005 | cn

I agree with chuck, but would like to add. 2D is a great option and helps to keep your printing process in check, it will measure the x & y coverage on the pad. It will help you determin when your stencil aps become clogged or when the bottom of your

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