Electronics Forum | Thu Jun 04 01:48:34 EDT 2009 | nibirta
yes, i know this part, and you are right. Tk you once again, Nico
Electronics Forum | Fri Nov 03 17:36:37 EST 2000 | Thomas Ballhausen
Thank you for your hint. According to the substrate supplier the thickness is less than 1 micron. After Ni/Co layer there is water rinse, then "gold strike", another rinse then "gold plating". But still the total Au layer shall be less than 1 micron
Electronics Forum | Wed Jun 03 01:59:41 EDT 2009 | nibirta
Thank you all for these helpfull informations. I knew that I always can have the right support from you :) Tks again. Nico
Electronics Forum | Mon Feb 23 05:46:26 EST 2009 | nibirta
thk you very much for your fast answers. And yes, I am suspecting the same things also. The problem is to convince the PCB supplier that is his fault. A big fight all the time. SO, i will double check everything you said, and I willl come back with r
Electronics Forum | Wed Mar 26 09:32:46 EDT 2008 | nibirta
well i do not know if u fixed this problem already. But i cand share form my experience some info with u. We used a vigon A200 solution for such an application. the cleaner is good. But...it gives u troubles depending on the quantity of flux. It can
Electronics Forum | Wed Nov 01 13:44:50 EST 2000 | Thomas Ballhausen
Using convection type reflow we observed following problem: One ball of a 313-PBGA appears to be dewetting. This happens randomly, i.e. no specific ball location, failure rate is rather low (3-4%), but since there are 12 PBGAs on one board the failu
Electronics Forum | Tue Nov 07 10:25:19 EST 2000 | Thomas Ballhausen
Thank you for your kind contribution and efforts in helping me. I just found out we have been talking different units; my microns were micro meter ...? So, let me get things right now: the substrate supplier confirmed the following data: Cu foil +
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