Electronics Forum | Sat Aug 02 08:06:11 EDT 2008 | pcbbuilders
Is there a limit to the time that most components can stay at temperatures around 130-200 deg c? if i slow the time, the first 4 zones will be at this temp for about 5 minutes in no lead process. i am concerned that some chips wont be rated at this t
Electronics Forum | Mon Aug 04 09:30:16 EDT 2008 | grics
If you have concerns, you can look at the datasheet for each component or contact one of their application or materials engineers and find out what the components are rated for...process-wise. IE, how long can I be in the oven with this part, at what
Electronics Forum | Sun Sep 04 01:59:41 EDT 2005 | smartasp
We need to dry and clean the air in our dedicated poting and conformal coating room. Can anybody help on how to go about it. The airconditions only recycle and dry until room temperature is reached and therefore have great fluctuations and unstable p
Electronics Forum | Tue Dec 30 09:31:52 EST 2014 | rgduval
I've always approached it like this: Design your processes and perform your work to class three standards, and inspect to the standard that is acceptable. That is, all work should be performed to the highest degree of quality. When the work is ins
Electronics Forum | Tue Jan 31 10:59:55 EST 2006 | carterhoward
Hi All, I�ve been doing some research on the issue of running lead-free solder paste and leaded solder paste through reflow at the same time. The point with this would be to process all standard leaded components with Lead paste while also processi
Electronics Forum | Thu Sep 01 06:41:43 EDT 2011 | kahrpr
We run lead free and leaded on all of our lines. When lead free first came out we went to the extremes to make sure not one atom of lead would get into the process. I remember we were told that the world would end if leaded products were within a hal
Electronics Forum | Wed Feb 01 07:32:05 EST 2006 | Chunks
Try an intermediate paste like Loctite/Henkle 218. It's design is to be used in a mixed lead/lead-free process.
Electronics Forum | Mon Mar 27 15:56:12 EDT 2017 | padawanlinuxero
Just 2 cents, lead free flux residue is no clean?, how about leaded flux? how much flux residue it leaves on both types? is there a clean up procedure after wave solder? or is there a wave solder process?
Electronics Forum | Wed Feb 01 06:02:59 EST 2006 | joe
Hi, SAC BGA's in a SnPb reflow process can be achieved by ensuring the temp. on the BGA is at a peak min of 220�C and a time above 207-210�C for 60 - 90 Sec. Lower temperatures have shown incomplete mixing of alloys and some voiding.
Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike
At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit
