Electronics Forum | Thu Jul 19 11:59:21 EDT 2007 | hussman
Phil is wrong. In the real world, we know that part mfgers have not changed every one of their parts to make them "high temp". They just changed the plating. Anyone who thinks otherwise, has never run a profile or touched a warm board coming out o
Electronics Forum | Mon Jul 16 09:53:36 EDT 2007 | ed_faranda
Yes, you can use lead-free parts in a leaded process. And the other is true as well, no-lead free parts in a leaded process. BUT, you should not use leaded parts through a non-lead wave solder process and of course, your board will not be RoSH.
Electronics Forum | Thu Jul 19 04:38:33 EDT 2007 | chrispy1963
I took a Lead Free troubleshooting Class at SMTA in Chicago last September taught by Phil Zarrow. He told us during that seminar that its not a good practice to cross contaminate Leaded and Lead Free components but IF it is necesary than using lead
Electronics Forum | Fri Jul 20 08:09:09 EDT 2007 | chrispy1963
In passives I dont know if anything changed at all other than the terminal plating. As for Active components there has been much engineering done to allow for the extra heat needed to liquify say SAC305 or other lead free pastes without damage to th
Electronics Forum | Mon Jul 16 10:17:22 EDT 2007 | realchunks
Yes you can use no-lead parts in a leaded process. Your solder joints will be weaker than they once were unless you change your solder paste. You can try to improve this by running a hotter reflow temp, but be careful since your flux was not design
Electronics Forum | Fri Jul 20 08:16:38 EDT 2007 | chrispy1963
I agree that it would be crazy to think that every part a company manufactured had to be re-engineered to allow for higher temps. Out of the question and I NEVER implied that at all. What I said was that Zarrow told us that it was alright to use lea
Electronics Forum | Mon Jul 16 10:26:54 EDT 2007 | davef
Ed: We agree with you that leadfree parts can be used with leaded paste. We disagree that lead part can be used with leadfree paste. Here is link to a previous discussion here on SMTnet on the topic: http://www.smtnet.com/forums/Index.cfm?CFApp=1&M
Electronics Forum | Mon Jul 16 10:51:09 EDT 2007 | patrickbruneel
D. Hillman, et al., �The Impact of Reflowing a Pb free Solder Alloy Using a Tin/Lead Solder Alloy Reflow Profile on Solder Joint Integrity,� International Conference on Lead-free Soldering, CMAP, Toronto, Ontario, Canada, May 24-26, 2005, http://www.
Electronics Forum | Mon Jan 17 09:02:27 EST 2005 | russ
I have found that with the TI ni/pd platings that a peak temp of 226 C is the best for joint strength. Russ
Electronics Forum | Thu Apr 20 22:46:26 EDT 2006 | samir
Amol, I thought I answered your question in another thread, dude! Anyway, to re-iterate. Yes, I was able to pull it off a hybrid profile. The LF BGA passed tensile testing, but no, it wasn't thermally cycled or stressed first to expose any latent
