Electronics Forum | Sun Sep 12 12:45:56 EDT 2010 | tony1
Hi there, does anyone experience in NiPdAu solderability dip & look test? I experiencing solder non wet issue on side I/O & also center ground for QFN package. Appreciate someone can offer me a solution. Thanks
Electronics Forum | Thu Sep 18 23:56:56 EDT 2008 | trynders
am having wetting issues with two Burr Brown Op amps. Both are SOICs with NiPdAu lead frame finishes. I have attached a photo that shows a black streak the length of the lead (before soldering). This appearance is consistent of all leads and is exist
Electronics Forum | Fri Sep 19 15:52:18 EDT 2008 | davef
This is not something that we'd expect to see on NiPdAu finished leads. Help us understand the extent of the problem better. From your picture, it looks like a band of copper color with black on the outer portions of the copper color that bleeds int
Electronics Forum | Mon Oct 19 15:43:37 EDT 2009 | dilogic
We have a problem with QFN IC's with NiPdAu plated pads. Our ULC's don't see the pads due to the almost ideal reflection. Vision sees the pads almost black. As we don't have OAL-cameras (which can help in this case, I assume), I am thinking of back-l
Electronics Forum | Mon Sep 20 11:21:48 EDT 2010 | tony1
I have this NiPdAu small QFN packge sizes less than 2x2. I tried to do solderability Dip And Look test and there's always some units no wet on either ground pad and small I/O. Can someone help to explain why is this so difficult to set on this surfac
Electronics Forum | Tue Apr 26 03:28:26 EDT 2005 | Just mee
What test is applicable to check for QFN package with NiPdAu leadframe if leads/pad are solderable? what are the options other than dip and look solderability testing? Thanks,
Electronics Forum | Fri Oct 20 05:55:16 EDT 2006 | Eric Chen
40% in wetting problem. I would like to know any specific reflow profile in order to acheive good wetting at this type of lead. Besides, any specific paste e.g. halide containing paste required
Electronics Forum | Mon Feb 19 15:32:42 EST 2007 | blnorman
We use SnPb paste and bar with leaded and non-leaded component finishes. The predominant finish on components we use is Tin, there are a few NiPdAu. We've had no problems with the component finishes used in the SnPb process.
Electronics Forum | Fri Sep 19 15:23:33 EDT 2008 | vladig
All I can say is my regular "Get it analyzed", so you'll know what the streak is. Regards, Vladimir
Electronics Forum | Sat Sep 20 09:31:42 EDT 2008 | vladig
Wise move :-) Please let me know the results of the analysis and we can take it from there. Vlad
