Electronics Forum: nippon (Page 1 of 1)

Solder Ball

Electronics Forum | Tue May 14 21:59:25 EDT 2013 | davef

SAC is a lead free solder alloy. At one time, Nippon Micrometal Corp. (NMC) [158-1, Sayamagahara, Iruma, 358-0032, Japan; +81.4.2934.6101 F+81.4.2934.5454 nmc-net.co.jp] called some of its alloys: LF35, LF45(SAC305), LF38(SAC105) and LF31(SAC405).


Electronics Forum | Thu Sep 24 22:30:23 EDT 1998 | Hank Hsiung

Dear Friends, I am looking for more information on plasma decapsulator for failure analysis of COB and BGA. So far I know only one manufacturer-Nippon Scientific who produce this machine. Have any of you used their machine? What is your opinion on

Re: decapsulation

Electronics Forum | Mon Nov 30 20:39:15 EST 1998 | Dave F

| I have a COB device that I need to decapsulate for failure analysis. | | I would like to find out how I can do it using common materials/process that I can easily find. | | Thank you and I look forward to hearing from you soon. | Trien: Level

solder fillet peeling update....

Electronics Forum | Fri Jul 11 10:00:05 EDT 2003 | davef

Component manufacturers recommend limits on the power and period of ultrasonic cleaning. Examples are: * PRECAUTIONS AND GUIDELINES MULTILAYER CERAMIC CAPACITORS: (9) Ultrasonic cleaning time shall be ten minutes maximum. When the power of ultrasoni

capacitors factory

Electronics Forum | Thu May 09 17:07:56 EDT 2002 | davef

Troubles, troubles, troubles. If it weren�t for bad luck, I wouldn't no luck at all, eh? Tough business. Comments on your trouble are: * On machine vision errors from less than ideal capacitors: This is life. Reprogram your machine to either wid

Assemby of flexible printed circuits

Electronics Forum | Wed May 16 15:40:56 EDT 2012 | davef

Here's some notes from a Bob Willis presentation Assembly of Flexible Circuits with Lead-Free Solder Alloy [Bob Willis leadfreesoldering.com] * Flexible Circuit Construction ** Base Material - 0.05mm Copper 18/18 um ESPANEX from Holders Technologies


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