Electronics Forum: nitrogen and soldering and quality (Page 1 of 8)

Flip Chip and lead-free soldering

Electronics Forum | Thu Jul 20 16:08:18 EDT 2000 | Grant Baynham

Do you have any experience with flip chip applications using lead-free solder, and specifically do you have any information revealing how the process parameters for standard air reflow atmosphere can be modified to match the results for solder reflow

Solder beads and wave soldering

Electronics Forum | Thu Jul 06 03:03:56 EDT 2006 | ronalds

Thank you all for your input. The MF300S Multicore flux is rated for lead free. There is not much dross or contamination. We are using nitrogen. I've tested the boards with the curing test of IPC-TM-650. I think you're all right about the preheat.

wave soldering and solder bridge

Electronics Forum | Mon Dec 17 12:06:58 EST 2007 | pjc

5 Steps to Eliminate Bridges: 1. Establish (wave) Parallelism First and foremost, you must establish board-to-wave parallelism. This is the prerequisite to any wave solder process control. For an understanding of the power of this approach go to ht

What is gonna impact boards without silkscreen on quality and mf

Electronics Forum | Fri Aug 17 09:35:15 EDT 2007 | karenp

We usually do Solder reworks, and some components that cannot be installed by SMT Machines or Wave solder due to specs or the technology in our company... aur work methods and instruction are always based on designators and are more illustrated to ca

SPC - Reflow and Wave soldering

Electronics Forum | Fri Sep 06 14:07:20 EDT 2002 | ppwlee

Thanks for all replying to my printing SPC posting. I like to expand the SPC discussion on reflow and wave soldering. I am aware of the common methods of applying periodic measurements using test vehicles though the machines to collect critical pr

soldering and bonding on gold PCB's

Electronics Forum | Wed Jan 09 14:52:53 EST 2002 | Chris

Hi, I have read many articles about theromsonically bonding to soft gold. Many of these articles state you can bond to 10uinches of gold. I have worked with both Hughes and Panasonic bonders at two different companies and I have never been able to

0201 and uBGA

Electronics Forum | Mon Sep 23 18:11:10 EDT 2002 | steveb

On an assembly reflowed in air saw the same thing: 0201's with a grainular solder joint, but 0402's and above with perfectly formed joints. Reflow profile all within acceptable tolerances. Reflowing in nitrogen solves this problem, but increases t

SPC and Wave

Electronics Forum | Fri Jul 15 09:43:37 EDT 2005 | dougs

HHmmmm!! looks like i'm getting it way wrong by wanting to chart the quality of product coming from my wave solder machine. could some of you let me know whats the best way to monitor quality on this process.

Material Ageing and Storage

Electronics Forum | Thu Feb 22 04:00:02 EST 2001 | Scott B

We are increasingly being asked to store components for longer and longer periods which we know through experience leads to reduction or total loss of solderability of the parts. 1) What is the industry accepted shelf life of tin/lead plated compone

Solder Balls and Humidity

Electronics Forum | Tue Aug 28 11:12:23 EDT 2007 | grics

This is what I was thinking, but I am being beat up pretty badly by the selective solder. Ambient temperature is anywhere in the the neighborhood of 76 - 80 degrees F. I am not sure of the RH, but I wouldn't think that would be my issue... One of

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