Electronics Forum | Mon Jun 11 22:06:00 EDT 2001 | davef
The issue is not the cleanliness of your in-bound water. The issue is the cleanliness of the board your customer receives. Look at J-STD-001C, Para 8, "Cleanliness Requirements". The end product cleanliness is the end result of your: * In-bound
Electronics Forum | Wed Jan 05 11:11:09 EST 2000 | Dave F
Hey Pat: My responses are: 1. Does anyone have experience with the shelf life on immersion white tin? If so, how long can the boards be stored without adversely affecting solderability. I've heard one year. No, we don�t, because we turn boards fa
Electronics Forum | Sun Jul 25 08:54:37 EDT 1999 | Tom Gervascio
| We are having a process related problem with pullup resistors on a controller card which has a I960 micro-processor. | The controller monitors signal inputs and it's own resources then blinks a LED to indicate its working. The problem is that after
Electronics Forum | Mon Sep 24 17:38:18 EDT 2001 | mparker
First question - do you have a rework station? If so, are you experiencing the same type of failures there? I have successfully used no-clean on uBGA's in the past. 6 mil solder bumps, 10 mil spacing. 88 sites. Are you reusing previously soldered uB
Electronics Forum | Tue Aug 17 09:59:50 EDT 1999 | Earl Moon
I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the adve
Electronics Forum | Mon Jun 28 13:12:34 EDT 1999 | Graham Naisbitt
| | We are anticipating switching from RMA to OA flux for both reflow and wavesolder in the next few months. If you use a batch cleaner running DI water only I would like to hear your experiences. How is it for cleaning under low standoff component
Electronics Forum | Fri Apr 10 20:35:59 EDT 1998 | Steve Gregory
| | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. T
Electronics Forum | Mon Apr 13 08:42:32 EDT 1998 | Bob Silveri
| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble
Electronics Forum | Fri May 14 16:08:38 EDT 1999 | Chrys Shea
| | | | | I am looking for anyone who has converted over to VOC Free flux. I need some info on any problems, etc. that you might have had. | | | | | | | | | | Please E-mail me at wes.ruggles@vickers-systems.com or call at (513) 494-5229 | | | | | |
Electronics Forum | Thu Aug 19 23:56:49 EDT 1999 | Earl Moon
| | I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the
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