Electronics Forum: no clean process (Page 106 of 208)

Solder Volume for Lower Profile PBGA

Electronics Forum | Fri Sep 30 19:14:35 EDT 2005 | DasonC

The stencil is 5 mil thick and the aperture is 12 mil sq. We found open but can't detect by x-ray. The process which we are using is no clean TIN/LEAD. Just thinking the ball size variance from 0.35~0.45mm per IPC-7095, in worst case scenarios, th

Re: solder balling

Electronics Forum | Thu Aug 10 13:16:17 EDT 2000 | Bob Willis

Here is some thing that I wrote a while back on solder beading. First what is a Solder Bead? The term solder bead is used to differentiate it from solder balls. A solder bead is a solder ball but its location is normally constant unlike solder bal

Corrosion

Electronics Forum | Tue Nov 04 19:34:27 EST 2003 | gregoryyork

Blimey that's a problem and a half. Water Solubles will look completely different residue wise than No Cleans, pending age and solids contents No Cleans will go white powdery - watersolubles will stay oily Alternatively process reworked PCB's through

Water Soluble Flux

Electronics Forum | Tue Nov 30 11:42:03 EST 2010 | hegemon

A simple question with very complex answers... But to simplify, you could start at this. Water soluble fluxes are cleaned using (typically) de-ionized water, using a spray wash method. Sometimes a saponifier is added to the water to help it get

Your opinion about RoHS and WEEE ?

Electronics Forum | Wed Jan 12 07:15:03 EST 2005 | clampron

Good Morning Everyone, This whole lead free thing has really stirred up the hornets nest! I agree that it doesnt make any technical sense to replace a cheap toxic material for an expensive toxic material that costs more, is more expensive to process

Freshman in SMT industry needing advice

Electronics Forum | Wed Sep 22 14:45:01 EDT 2004 | Michelle Ogihara

As many people have participated in this email string, including competitors and customers of Sawa, I would like to respond to especially one rather detailed email expressing concerns with this stencil cleaning system. Also, this teaches me to keep

Re: Cleaning PCB's after routing

Electronics Forum | Sun May 24 06:02:33 EDT 1998 | Earl Moon

| Hello, | I am looking for suggestions for cleaning pcb's after the routing (fabrication) process. Keep in mind that these pcb do not have components intalled on them yet. | We have considered pre-drilling the routing plunge points, but cost and ca

Flux Compatibility Issues....

Electronics Forum | Fri Jun 09 15:46:34 EDT 2006 | samir

I say: �Wave flux needs to be heated to certain activation temps which won't be repeatedly achieved with a manual soldering process. Plus, you won't burn off any residual activator as you would if the board were immersed in a solder bath.� Muse say

Re: BGA collapse during reflow

Electronics Forum | Mon Jul 12 12:28:10 EDT 1999 | Wolfgang Busko

| I need some advice concerning reflow of a BGA-292. Since I am not ready to change my entire process to no-clean, I decided to place the lone BGA-292 on a proto run using our BGA re-work station. The pcb is a moderately dense, single-sided, 8-laye

Re: solder land analisys

Electronics Forum | Thu Jul 15 19:05:58 EDT 1999 | Earl Moon

| | | We have been encountering diminishing ball shear readings these past few weeks, despite the fact that we did not change any ball shear tester parameter. Our reflow parameters are also within spec limits. ( 210-220 deg C max temp. and 40-60 sec


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