Electronics Forum: no and clean (Page 1 of 41)

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Wed Oct 02 15:20:55 EDT 2002 | Eric

Is there a steadfast rule of thumb for a good solder joint on an Enig Gold board. I come across this number 217C when discussing BGA profiles. Is this a published number? I sure could use a reference. Anybody feedback is appreciated.

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Wed Oct 02 16:13:05 EDT 2002 | babe

Have you had your solder pot tested? I find that levels of contaminants can rend a solder joint that dull look.

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 14:43:43 EDT 2002 | Jim M.

unsure of what solder spec. your working to?.IPC/EIA J-STD-001C, Section 9.2.4 clearly states dull, matte, gray or grainy appearing solders are accpetable depending on your process and if the acceptability of the neaxt paragraph is met.IPC 610 and J-

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Wed Oct 02 18:18:58 EDT 2002 | davef

The steadfast rule of thumb is: In order to get reliable reflow, you need to be at or higher than [liquidus + 20�C] for about 5 to 10 seconds, rather than those old "60 seconds above 183�C" guideline. This provides for setting your peak based on the

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 11:44:23 EDT 2002 | abelardo

Hello everyone out there in the SMT world. I have a dilema I'm currently running a board that has 3 csp's with a .75 mm. ball pitch and .3mm ball size. And 2 qfp's-160. The stencil is 4 mils thick and I'm using a 63/37 solder paste. My reflow prof

Gold plated board, with csp's and 0603 with no clean apetures

Electronics Forum | Thu Sep 26 20:43:51 EDT 2002 | davef

"OK. If the connection doesn't look like I expect it to look, how do I know that the metallurgy is correct?" Comments are: * There are no pictures that will get you though this. * You should expect that gold that is dissolved in Pb/Sn solder to make

Cleanning no clean residu

Electronics Forum | Fri Oct 19 16:24:53 EDT 2007 | jmelson

Really, if you start out from the beginning planning to clean the boards, then DON'T use the no-clean flux! The way that stuff is made, it leaves a hard, low-solubility residue that takes a LOT of effort to get clean. If you plan to clean, use a wa

Cleanning no clean residu

Electronics Forum | Fri Oct 19 11:51:25 EDT 2007 | rgduval

By definition, no clean solder can be not-cleaned. The solder/flux are formulated to result in low ionic-contamination, hence, no cleaning. I have, however, always had at least one customer that requests their no-clean solder get cleaned. No-clean

Cleanning no clean residu

Electronics Forum | Fri Oct 19 13:57:17 EDT 2007 | Michael Konrad

Hi Rob, I must take issue with your statement �By definition, no clean solder can be not-cleaned�. All no-clean fluxes can be cleaned. Whether or not one cleans no-clean depends on a variety of factors. More than eighty percent of all post reflow

Cleanning no clean residu

Electronics Forum | Mon Oct 22 08:54:27 EDT 2007 | rgduval

Michael, You're right, of course. A major mis-type on my end. What I meant to say is that no-clean fluxes are designed to not _require_ cleaning to meet industry cleanliness standards. Cheers ..rob

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